Patents by Inventor Bernhard Ostrick

Bernhard Ostrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11177059
    Abstract: A film resistor and a film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer comprising a M1+nAXn phase, wherein M comprises at least one transition metal, A comprises a main-group element, and X comprises carbon and/or nitrogen, and wherein n=1, 2 or 3.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: November 16, 2021
    Assignee: TDK ELECTRONICS AG
    Inventors: Bettina Milke, Bernhard Ostrick
  • Patent number: 10670548
    Abstract: A sensor module has a first sensor element and a second sensor element. The first sensor element and the second sensor element are accommodated in a common housing of the sensor module. The sensor module includes a conductor structure that comprises an electrode structure and a separate connection structure. The connection structure is connected in an electrically conductive manner to the first sensor element and the electrode structure is allocated to the second sensor element.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: June 2, 2020
    Assignee: EPCOS AG
    Inventors: Bernhard Ostrick, Peter Balzer
  • Publication number: 20200118719
    Abstract: A film resistor and a thin-film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer including a first transition metal carbide.
    Type: Application
    Filed: June 18, 2018
    Publication date: April 16, 2020
    Applicants: TDK Electronics AG, TDK Electronics AG
    Inventors: Bettina Milke, Bernhard Ostrick
  • Publication number: 20200118721
    Abstract: A film resistor and a film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer comprising a M1+nAXn phase, wherein M comprises at least one transition metal, A comprises a main-group element, and X comprises carbon and/or nitrogen, and wherein n=1, 2 or 3.
    Type: Application
    Filed: April 12, 2018
    Publication date: April 16, 2020
    Applicant: TDK Electronics AG
    Inventors: Bettina Milke, Bernhard Ostrick
  • Publication number: 20180292211
    Abstract: A MEMS yaw-rate sensor is disclosed. In an embodiment, the MEMS yaw-rate sensor includes a first primary mass configured to perform a primary oscillation relative to a main body, a first secondary mass connected to the first primary mass via a first suspension such that a primary movement of the first primary mass excites a primary movement of the first secondary mass and a secondary movement of the first secondary mass relative to the first primary mass is permitted, a first magnetic-field-generating element and a first magnet-sensitive element, one being arranged on the main body and one being arranged on the first primary mass, wherein the first magnet-sensitive element is configured to determine the primary movement of the first primary mass relative to the main body and a second magnetic-field-generating element and a second magnet-sensitive element.
    Type: Application
    Filed: September 27, 2016
    Publication date: October 11, 2018
    Inventors: Marcus Besson, Bernhard Ostrick
  • Patent number: 10018656
    Abstract: A device, an arrangement, and a method for measuring a current intensity in a primary conductor through which current flows are disclosed. In an embodiment, an apparatus includes a magnetic field-generating element configured to generate a reference magnetic field; and a magnetic field angle-sensitive element configured to measure an orientation of a total magnetic field, the total magnetic field is produced by overlapping of the primary magnetic field and the reference magnetic field in space, wherein the primary magnetic field and the reference magnetic field are not parallel to one another at a location of the magnetic field angle-sensitive element, and wherein the current intensity of the current flowing through the primary conductor is determinable from the orientation of the total magnetic field in space.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: July 10, 2018
    Assignee: EPCOS AG
    Inventors: Bernhard Ostrick, Carsten Dehoff
  • Patent number: 9909946
    Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to ?40° C. and less than or equal to 150° C.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: March 6, 2018
    Assignee: EPCOS AG
    Inventors: Jan Ihle, Andreas Peschka, Bert Hundertmark, Benjamin Bohl, Bernhard Ostrick
  • Publication number: 20170184687
    Abstract: A sensor is disclosed. In an embodiment, the sensor includes a fixed structure, a movable structure movable relative to the fixed structure, a magnet configured to generate a magnetic field and a first magnetically sensitive element configured to determine the magnetic field at a position of the first magnetically sensitive element. The magnet is fastened to the fixed structure and the first magnetically sensitive element is fastened to the movable structure. Alternatively, the magnet is fastened to the movable structure and the first magnetically sensitive element is fastened to the fixed structure.
    Type: Application
    Filed: July 6, 2015
    Publication date: June 29, 2017
    Applicant: EPCOS AG
    Inventors: Bernhard Ostrick, Wolfgang Schreiber-Prillwitz
  • Publication number: 20170089796
    Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to ?40° C. and less than or equal to 150° C.
    Type: Application
    Filed: December 14, 2016
    Publication date: March 30, 2017
    Inventors: Jan Ihle, Andreas Peschka, Bert Hundertmark, Benjamin Bohl, Bernhard Ostrick
  • Publication number: 20160266172
    Abstract: A device, an arrangement, and a method for measuring a current intensity in a primary conductor through which current flows are disclosed. In an embodiment, an apparatus includes a magnetic field-generating element configured to generate a reference magnetic field; and a magnetic field angle-sensitive element configured to measure an orientation of a total magnetic field, the total magnetic field is produced by overlapping of the primary magnetic field and the reference magnetic field in space, wherein the primary magnetic field and the reference magnetic field are not parallel to one another at a location of the magnetic field angle-sensitive element, and wherein the current intensity of the current flowing through the primary conductor is determinable from the orientation of the total magnetic field in space.
    Type: Application
    Filed: October 29, 2014
    Publication date: September 15, 2016
    Inventors: Bernhard Ostrick, Carsten Dehoff
  • Publication number: 20160069831
    Abstract: A sensor module has a first sensor element and a second sensor element. The first sensor element and the second sensor element are accommodated in a common housing of the sensor module. The sensor module includes a conductor structure that comprises an electrode structure and a separate connection structure. The connection structure is connected in an electrically conductive manner to the first sensor element and the electrode structure is allocated to the second sensor element.
    Type: Application
    Filed: April 9, 2014
    Publication date: March 10, 2016
    Inventors: Bernhard Ostrick, Peter Balzer
  • Publication number: 20160013112
    Abstract: A sensor system includes a sensor chip mounted on a mounting receptacle of a ceramic housing body. The housing body is shaped three-dimensionally and embodied monolithically and is formed by a ceramic material having a coefficient of thermal expansion which deviates from the coefficient of thermal expansion of the sensor chip by less than 30% in a temperature range of greater than or equal to ?40° C. and less than or equal to 150° C.
    Type: Application
    Filed: November 20, 2013
    Publication date: January 14, 2016
    Inventors: Jan Ihle, Bernhard Ostrick, Wolfgang Schreiber-Prillwitz
  • Publication number: 20150377734
    Abstract: A pressure sensor system having a pressure sensor chip is specified, which is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to ?40° C. and less than or equal to 150° C.
    Type: Application
    Filed: January 20, 2014
    Publication date: December 31, 2015
    Inventors: Jan IHLE, Andreas PESCHKA, Bert HUNDERTMARK, Benjamin BOHL, Bernhard OSTRICK
  • Publication number: 20150047435
    Abstract: A micromechanical measuring element has a sensitive element that comprises a diaphragm with an underside and an upper side. The micromechanical measuring element also has a cap, which is connected directly to the sensitive element. The sensitive element and the cap form a first chamber, which has a first opening.
    Type: Application
    Filed: February 8, 2013
    Publication date: February 19, 2015
    Inventors: Bernhard Ostrick, Michael Schiffer
  • Publication number: 20130015537
    Abstract: A pressure sensor (1) is provided which has a piezoresistive membrane (2) which can be deformed by the action of the pressure of a medium. The membrane (2) is arranged on a carrier substrate (3) and extends over an opening (32) in the carrier substrate (3). The pressure sensor (1) has a protective layer (4) to protect the membrane (2) from direct contact with a medium. The protective layer (4) covers the membrane (2) both in a first region (28) inside the opening (32) and in a second region (29) outside the opening (32). Furthermore, a process for producing a pressure sensor (1) is provided in which the protective layer (4) forms an etch stop for an etching process.
    Type: Application
    Filed: December 14, 2010
    Publication date: January 17, 2013
    Applicant: EPCOS AG
    Inventors: Birgit Nowak, Bernhard Ostrick, Andreas Peschka
  • Patent number: 8177425
    Abstract: A temperature-measuring device with a sensing head and a pipe piece is disclosed. The sensing head is embedded in the pipe piece. The pipe piece is provided for conducting a medium whose temperature is detected by the sensing head.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: May 15, 2012
    Assignee: EPCOS AG
    Inventors: Wolfgang Grundmann, Bernhard Ostrick, Peter Balzer
  • Patent number: 7985021
    Abstract: A probe includes a sensing element and a carrier for the sensing element. The carrier has an integrated device for guiding an air stream to the sensing element, and a long axis perpendicular to a plane defined by the flow direction of the air stream. The probe is substantially symmetric with respect to the plane.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: July 26, 2011
    Assignee: EPCOS AG
    Inventors: Oliver Bard, Bernhard Ostrick
  • Publication number: 20090207878
    Abstract: A probe includes a sensing element and a carrier for the sensing element. The carrier has an integrated device for guiding an air stream to the sensing element, and a long axis perpendicular to a plane defined by the flow direction of the air stream. The probe is substantially symmetric with respect to the plane.
    Type: Application
    Filed: February 14, 2007
    Publication date: August 20, 2009
    Inventors: Oliver Bard, Bernhard Ostrick
  • Publication number: 20090193887
    Abstract: A temperature-measuring device with a sensing head and a pipe piece is disclosed. The sensing head is embedded in the pipe piece. The pipe piece is provided for conducting a medium whose temperature is detected by the sensing head.
    Type: Application
    Filed: January 5, 2009
    Publication date: August 6, 2009
    Inventors: Wolfgang Grundmann, Bernhard Ostrick, Peter Balzer
  • Patent number: 6915678
    Abstract: An ozone sensor has an ozone-sensitive layer containing an ozone-sensitive material which is encapsulated in a polymer or in a polymer mixture or is coated by at least one polymer or polymer mixture. Advantages result from a longer service life of the ozone-sensitive materials which, because of their high hygroscopic properties, would not be stable without encapsulation or coating. Furthermore, a polymer matrix can be selectively used as a filter or in order to eliminate interfering influences.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: July 12, 2005
    Assignee: Siemens Aktiengesellschaft
    Inventors: Maximilian Fleischer, Hans Meixner, Bernhard Ostrick, Roland Pohle, Elfriede Simon, Martin Zimmer