Abstract: A method of visualizing a plan in real dimensions, wherein, in a calibration step, using a grid reflection method, a transmission pattern is projected onto a projection surface by means of a projection unit, and a reception pattern reflected from the projection surface is detected by at least two sensor units, and a surface shape and a location of the projection surface in relation to a position of the projection unit and to a position of the sensor units are detected by means of a computer unit connected to the projection unit and the sensor units, based on a distortion of the reception pattern in comparison to the transmission pattern, and a projection distortion is performed on the plan by means of the computer unit based on the surface shape and the location of the projection surface in relation to the projection unit, as detected in the calibration step, and the distorted plan is projected by the projection unit onto the projection surface in such a way that the projected plan on the projection surface c

Abstract: For a simple, fast, safe and reliable determination of the layer thickness of a bonding layer between two layers of a packaging, a laser ultrasonic method is provided, in which the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is determined in advance, and a maximum (M1, M2, Mn) in the measurement signal (S) is sought, and the point in time of occurrence of this maximum (M1, M2, Mn) is determined as the total transit time (T1, T2, Tn) of the ultrasonic wave, and the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is subtracted from the total transit time (T1, T2, Tn), and the thickness (d) of the bonding layer is deduced from the known ultrasonic speed (vS) in the bonding layer (5).

Abstract: For a simple, fast, safe and reliable determination of the layer thickness of a bonding layer between two layers of a packaging, a laser ultrasonic method is provided, in which the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is determined in advance, and a maximum (M1, M2, Mn) in the measurement signal (S) is sought, and the point in time of occurrence of this maximum (M1, M2, Mn) is determined as the total transit time (T1, T2, Tn) of the ultrasonic wave, and the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is subtracted from the total transit time (T1, T2, Tn), and the thickness (d) of the bonding layer is deduced from the known ultrasonic speed (vS) in the bonding layer (5).