Abstract: A heat pipe (10) for cooling an electronic device, especially a component carrier (100), that comprises a central section (13) with a cavity (12) filled with a heat transfer fluid (20). In longitudinal direction (11) of the heat pipe (10) directly connected with the central section (13) are a first end section (14) on a first end of the central section and a second end section (15) on the opposite second end of the central section, wherein the first end section and the second end section each comprise a landing structure (17) with a surface length (SL, SL1, SL2) and a surface width (SW, SW1, SW2) and wherein each landing structure is thermoconductively coupled with the central section of the heat pipe. A component carrier comprising at least one heat pipe for cooling it, and a method for producing the component carrier are also provided.