Abstract: A pressure transducer package comprising a substrate and a lid is attached to the substrate, where a cavity is defined underneath the lid. A MEMS pressure transducer is arranged inside the cavity, the MEMS pressure transducer covering a fluid port. A package pad is provided at a first side of the package, while the fluid port is provided at an opposite second side of the package. A transfer block is configured to provide an electric path between the MEMS pressure transducer and the oppositely arranged package pad, where at least one of the lid and the rigid transfer block comprises an assembly tolerance portion for providing a mechanical assembly tolerance between the rigid transfer block and at least one of the substrate and the lid.

Abstract: In an embodiment an MEMS pressure transducer package includes a substrate comprising a through hole, a MEMS pressure transducer device covering the through hole from a first substrate side and an environmental barrier structure covering the through hole from the first substrate side or an opposite second substrate side, wherein the environmental barrier structure includes a compliant membrane suspended inside a frame and a fluid channel extending through the frame, and wherein the fluid channel is configured to provide a fluid communication between a first side and an opposite second side of the membrane.

Abstract: A method for producing a gas sensor includes providing a substrate; depositing a semiconductor-based layer on the substrate; producing a first sensor element in the semiconductor-based layer, the first sensor element forming a resonant element; and mounting a cover on the first sensor element, where at least one of the substrate or the cover includes an opening to allow a passage of a gas to the first sensor element

Abstract: A pressure transducer package comprising a substrate and a lid is attached to the substrate, where a cavity is defined underneath the lid. A MEMS pressure transducer is arranged inside the cavity, the MEMS pressure transducer covering a fluid port. A package pad is provided at a first side of the package, while the fluid port is provided at an opposite second side of the package. A transfer block is configured to provide an electric path between the MEMS pressure transducer and the oppositely arranged package pad, where at least one of the lid and the rigid transfer block comprises an assembly tolerance portion for providing a mechanical assembly tolerance between the rigid transfer block and at least one of the substrate and the lid.

Abstract: A gas sensor comprises a substrate, a first semiconductor-based sensor element for determining the density and/or viscosity of a gas, which element is arranged above the substrate and which has a resonant element, and a cover arranged above the first sensor element, wherein the substrate and/or the cover has an opening to allow the passage of a gas to the first sensor element.

Abstract: The invention relates to a device for optically detecting biofilm in the oral cavity, wherein at least one sensor unit is provided, wherein the sensor unit has a camera, which points with its optical detection region into a receiving space of the device and serves to record surfaces that are to be detected.

Abstract: A package includes a substrate having a first surface and an opposing second surface, a first cavity adjacent to the first surface of the substrate within the package, and a second cavity adjacent to the second surface of the substrate within the package, wherein the second cavity includes a fluid opening for allowing a fluid to enter the second cavity; a through hole in the substrate providing fluid communication between the first and second cavities; a MEMS sound transducer disposed in one of the first cavity or the second cavity; a MEMS pressure sensor disposed in the other one of the first cavity or the second cavity; and a discrete transfer block arranged on the substrate and configured to provide an electric path between the package pad and the MEMS sound transducer and the MEMS pressure sensor, wherein the transfer block is a discrete component separate from the substrate.

Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide.

Abstract: A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.

Abstract: The invention relates to a method for cleaning surfaces, wherein a liquid volume is produced around a surface to be cleaned and, using at least one assembly comprising at least one nozzle and a heating device, vapor bubbles composed of wet vapor or saturated vapor and/or bubbles composed of a superheated vapor are produced and are directed by the at least one nozzle at the surface to be cleaned.

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Abstract: A radar chip package includes a radar monolithic microwave integrated circuit (MMIC) having a backside, a frontside arranged opposite to the backside, and lateral sides that extend between the backside and the frontside, wherein the radar MIMIC comprises a recess that extends from the backside at least partially towards the frontside; a plurality of electrical interfaces coupled to the frontside of the radar MIMIC; at least one antenna arranged at the frontside of the radar MIMIC; and a lens formed over the recess and the at least one antenna, wherein the lens is coupled to the backside of the radar MMIC.

Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package, which is mounted on the printed circuit board at a first mounting point and has a radio-frequency chip and a radio-frequency radiation element, wherein the printed circuit board has a first elasticity at least in a first section comprising the first mounting point. The radio-frequency device further comprises a waveguide component, which is mounted on the printed circuit board at a second mounting point and has a waveguide, wherein the radio-frequency radiation element is configured to radiate signals into the waveguide and/or to receive signals by way of the waveguide. The printed circuit board has a second elasticity at least in a second section with an increased elasticity between the first mounting point and the second mounting point, wherein the second elasticity is higher than the first elasticity.

Abstract: A radio frequency (RF) device includes a conformal RF antenna configured to be mounted on a non-metallic component of a vehicle and configured to operate at frequencies greater than 10 GHz. The RF device further includes an RF chip mounted on the conformal RF antenna and electrically coupled to the conformal RF antenna to transfer an RF signal of a frequency greater than 10 GHz to the conformal RF antenna.

Abstract: A gas sensor device contains a cavity delimited by an electrically conductive material and having gas-permeable openings and reflective surfaces, and also a radio-frequency component, including a radio-frequency chip and at least one radio-frequency antenna configured to emit radio-frequency signals into the cavity and to receive radio-frequency signals from the cavity.

Abstract: A radio-frequency device comprises an encapsulation material and a radio-frequency chip embedded into the encapsulation material, wherein the radio-frequency chip has a first main surface and a second main surface. The radio-frequency device furthermore comprises an electrical redistribution layer arranged over the first main surface of the radio-frequency chip and the encapsulation material, and a radio-frequency antenna formed in the redistribution layer and configured to emit signals in a direction pointing from the second main surface to the first main surface and/or to receive signals in a direction pointing from the first main surface to the second main surface. The radio-frequency device furthermore comprises a microwave component having an electrically conductive wall structure, the microwave component being arranged below the radio-frequency antenna and embedded into the encapsulation material.

Abstract: A light fixture has a translucent tubular bulb. At least one end cap is located at one end of the translucent tubular bulb. A light engine is disposed in the translucent tubular bulb. The light engine has a leadframe on which a plurality of semiconductor light elements is arranged. The fixture may include an electronic driver. The electronic driver includes a plurality of electronic components. At least one of the plurality of electronic components is arranged inside the transparent tubular bulb.

Abstract: An LED illumination device corresponds to a compact fluorescent lamp and has improved thermal properties. The illumination device includes a transparent tube having an inner wall defining a cavity, a light engine having one or more light emitting diodes, and a driver to drive the light engine. The light engine is disposed at the inner wall of the transparent tube. The arrangement of the light engine and the one or more light emitting diodes at the inner wall of the tube provides improved lighting characteristics. Simultaneously, an improved cooling is provided by the interface surface for conducting heat between the inner wall and the light engine.

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Abstract: A gas sensor comprises a substrate, a first semiconductor-based sensor element for determining the density and/or viscosity of a gas, which element is arranged above the substrate and which has a resonant element, and a cover arranged above the first sensor element, wherein the substrate and/or the cover has an opening to allow the passage of a gas to the first sensor element.