Abstract: A barrier film laminate (1) comprising an organic layer (4) that is situated in between two inorganic layers (2,3). The organic layer comprises submicron getter particles (5) at an amount between 0.01 and 0.9% by weight. The barrier film laminate can be used for encapsulating organic electronic devices such as OLEDs. The long term homogenous transparency makes this laminate in particular suited for protecting the light emitting side of an OLED.

Abstract: The present invention relates to a radiation curable composition. In particular, the present invention relates to a radiation curable composition with hydrophilic nanoparticles for use in barrier stacks for protection of sensitive devices against moisture.

Abstract: A barrier film laminate (1) comprising an organic layer (4) that is situated in between two inorganic layers (2,3). The organic layer comprises submicron getter particles (5) at an amount between 0.01 and 0.9% by weight. The barrier film laminate can be used for encapsulating organic electronic devices such as OLEDs. The long term homogenous transparency makes this laminate in particular suited for protecting the light emitting side of an OLED.

Abstract: The present invention relates to a radiation curable composition. In particular, the present invention relates to a radiation curable composition with hydrophilic nanoparticles for use in barrier stacks for protection of sensitive devices against moisture.

Abstract: An apparatus is described for coating a flexible substrate with at least a first organic layer and a first inorganic layer. The apparatus comprises a first and a second chamber and an atmosphere decoupling slot between the first and the second chamber. A printing facility is arranged in the first chamber, for printing the flexible substrate with a mixture comprising at least one precursor for a polymer, oligomer or a polymer network and a polymerization initiator. A curing facility is arranged in the first chamber, for curing the deposited mixture, therewith forming the at least first organic layer. A vapor deposition facility is arranged in the second chamber, for depositing the at least first inorganic layer at the substrate provided with the at least first organic layer. The apparatus comprises a facility for guiding the flexible substrate along the printing facility, along the curing facility and via the atmosphere decoupling slot along the vapor deposition facility.

Abstract: An apparatus is described for coating a flexible substrate with at least a first organic layer and a first inorganic layer. The apparatus comprises a first and a second chamber and an atmosphere decoupling slot between the first and the second chamber. A printing facility is arranged in the first chamber, for printing the flexible substrate with a mixture comprising at least one precursor for a polymer, oligomer or a polymer network and a polymerization initiator. A curing facility is arranged in the first chamber, for curing the deposited mixture, therewith forming the at least first organic layer. A vapor deposition facility is arranged in the second chamber, for depositing the at least first inorganic layer at the substrate provided with the at least first organic layer. The apparatus comprises a facility for guiding the flexible substrate along the printing facility, along the curing facility and via the atmosphere decoupling slot along the vapor deposition facility.

Abstract: The present invention relates to functionalized acrylate polymers, a process for their preparation, photopolymerizable compositions comprising these polymers and the use of the compositions, especially in the production of electronic components. The functionalized acrylate polymers are reaction products comprising at least a) acrylic acid or methacrylic acid or a mixture of acrylic and methacrylic acid and b) a (meth)acrylic ester of substituted or unsubstituted phenol, C1-C8 hydroxyalkylbenzene or C1-C8 hydroxyalkoxybenzene and methyl(meth)acrylate in a molar ratio of from 5:95 to 100:0. 5-90% of the acrylic or methacrylic acid units having reacted with a glycidylvinyl compound.

Abstract: Linear crosslinkable polyurethanes obtained from (a) at least one diisocyanate having 2 to 30 carbon atoms, (b) at least one aliphatic or cycloaliphatic diol having 2 to 30 carbon atoms, to whose carbon chain at least one carboxyl group is covalently bonded, and some or all of said carboxyl groups have been esterified with an olefinically unsaturated C3-C8alcohol or with the glycidyl ester of an olefinically unsaturated C3-C8carboxylic acid, and (c) optionally at least one aliphatic or cycloaliphatic diol having 2 to 30 carbon atoms, to whose carbon chain at least one carboxyl group is covalently bonded. The polyurethanes are suitable, alone or as a mixture with other reactive components, for thermal and/or photochemical crosslinking in crosslinkable compositions for the production of mouldings, coatings and in particular solder masks.

Abstract: Linear crosslinkable polyurethanes obtained from (a) at least one diisocyanate having 2 to 30 carbon atoms, (b) at least one aliphatic or cycloaliphatic diol having 2 to 30 carbon atoms, to whose carbon chain at least one carboxyl group is covalently bonded, and some or all of said carboxyl groups have been esterified with an olefinically unsaturated C3-C8alcohol or with the glycidyl ester of an olefinically unsaturated C3-C8carboxylic acid, and (c) optionally at least one aliphatic or cycloaliphatic diol having 2 to 30 carbon atoms, to whose carbon chain at least one carboxyl group is covalently bonded. The polyurethanes are suitable, alone or as a mixture with other reactive components, for thermal and/or photochemical crosslinking in crosslinkable compositions for the production of mouldings, coatings and in particular solder masks.

Abstract: The present invention relates to functionalized acrylate polymers, a process for their preparation, photopolymerizable compositions comprising these polymers and the use of the compositions, especially in the production of electronic components. The functionalized acrylate polymers are reaction products comprising at least a) acrylic acid or methacrylic acid or a mixture of acrylic and methacrylic acid and b) a (meth)acrylic ester of substituted or unsubstituted phenol. C1-C8-hydroxyalkylbenzene or C1-C8-hydroxyalkoxybenzene and methyl(meth)acrylate in a molar ratio of from 5.95 to 100.0. 5-90% of the acrylic or methacrylic acid units having reacted with a glycidylvinyl compound.

Abstract: A carboxyl group-containing epoxy acrylate is prepared by the reaction of an epoxy resin advanced with an aromatic biphenol compound which is reacted with a polycarboxylic acid anhydride in the presence or absence of a catalyst and a polymerization inhibitor at an elevated temperature. The carboxyl group-containing epoxy acrylate is mixed with a photoinitiator to obtain a photoresist formulation.

Abstract: Epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae III and IV of the claims that are relatively polymolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae III and IV of the claims that are relatively polymolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae III and IV of the claims that are relatively polymolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.