Patents by Inventor Bernhard Steger

Bernhard Steger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEATING SYSTEM COMPONENT FOR SENSING A FIRST AND SECOND TEMPERATURE
    Publication number: 20240003760
    Abstract: The present invention relates to a heating system component, comprising a carrier unit having a dry side, a wet side, a groove provided on the dry side, and a medium leading section at least partially opposite a medium flow area on the wet side; a heating unit at least partially received in the groove; a heat conducting plate assembly that comprises a first heat capturing plate portion that is thermally coupled to the heating unit, a second heat capturing plate portion that is thermally coupled to the medium leading section of the carrier unit, a first heat releasing plate portion, and a second heat releasing plate portion; at least one printed circuit board comprising circuitry with a first sensor area and a second sensor area, wherein the circuitry is configured to sense a first temperature at the first sensor area and a second temperature at the second sensor area; a housing accommodating at least a part of the printed circuit board and at least a part of the heat conducting plate assembly in such a way th
    Type: Application
    Filed: December 3, 2021
    Publication date: January 4, 2024
    Inventors: Johann HÖFER, Bernhard STEGER, Mladen Gojkic
  • Heating System Component for Sensing a First and Second Temperature
    Publication number: 20220178582
    Abstract: The present invention relates to a heating system component, including a carrier unit having a dry side, a wet side, a groove provided on the dry side, and a medium leading section at least partially opposite a medium flow area on the wet side; a heating unit at least partially received in the groove; a heat conducting plate assembly that comprises a first heat capturing plate portion that is thermally coupled to the heating unit, a second heat capturing plate portion that is thermally coupled to the medium leading section of the carrier unit, a first heat releasing plate portion, and a second heat releasing plate portion; at least one printed circuit board comprising circuitry with a first sensor area and a second sensor area, wherein the circuitry is configured to sense a first temperature at the first sensor area and a second temperature at the second sensor area; a housing accommodating at least a part of the printed circuit board and at least a part of the heat conducting plate assembly in such a way tha
    Type: Application
    Filed: December 2, 2021
    Publication date: June 9, 2022
    Inventors: Johann Höfer, Bernhard Steger