Abstract: One aspect of the invention relates to a transceiver device with a substrate with a layer of dielectric material with a relative permeability of greater than 1 and/or with a magnetic material with a relative magnetic permeability of greater than 1. An antenna is monolithically integrated in the substrate and/or in the layer, and the antenna is arranged for transmitting and for receiving signals. A circuit is monolithically integrated in the substrate which is coupled to the monolithically integrated antenna.

Abstract: A memory chip has a signal line and a complex impedance which is connected to the signal line for termination of the signal line. A memory having such a memory chip and a method for operating a memory chip are also described. The memory chip on the memory having a signal line that is terminated with a complex impedance.

Abstract: One aspect of the invention relates to a transceiver device with a substrate with a layer of dielectric material with a relative permeability of greater than 1 and/or with a magnetic material with a relative magnetic permeability of greater than 1. An antenna is monolithically integrated in the substrate and/or in the layer, and the antenna is arranged for transmitting and for receiving signals. A circuit is monolithically integrated in the substrate which is coupled to the monolithically integrated antenna.

Abstract: A method and an apparatus is disclosed for two-dimensional profiling of doping profiles of a material sample with scanning capacitance microscope. A scanning of a two-dimensional structure of a dielectric or partially dielectric material sample with a tip of a probe of the scanning microscope is carried out. The change in capacitance during the scanning motion of the probe from one position on the material sample to the next is measured. Finally, an evaluation of the change in capacitance during the scanning motion of the probe from one position on the material sample to the next as a current is carried out.

Abstract: A smart card having a support element, at least one electrically conductive contact-making element in a surface area of the support element, and at least one electrical circuit, which is on and/or in the support element, and is coupled to the at least one electrically conductive contact-making element. Microstructures and/or nanostructures are incorporated in the at least one electrically conductive contact-making element, of such a size that the microstructures and/or nanostructures absorb electromagnetic radiation at at least one wavelength.