Abstract: A driver includes a low-resistance charging path between a supply voltage rail and a first output node, a high-resistance charging path between the supply voltage rail and the first output node, an inverter coupled to the first output node and configured to enable and disable the low-resistance charging path, and a high-resistance discharging path between the first output node and a second output node. The first output node is coupled to a control terminal of a pass gate transistor in some implementations. The low-resistance charging path charges a voltage on the first output node to a threshold voltage of the pass gate transistor, and the high-resistance charging path charges the voltage on the first output node greater than the threshold voltage of the pass gate transistor. The high-resistance discharging path discharges the voltage on the first output node.

Abstract: A driver includes a low-resistance charging path between a supply voltage rail and a first output node, a high-resistance charging path between the supply voltage rail and the first output node, an inverter coupled to the first output node and configured to enable and disable the low-resistance charging path, and a high-resistance discharging path between the first output node and a second output node. The first output node is coupled to a control terminal of a pass gate transistor in some implementations. The low-resistance charging path charges a voltage on the first output node to a threshold voltage of the pass gate transistor, and the high-resistance charging path charges the voltage on the first output node greater than the threshold voltage of the pass gate transistor. The high-resistance discharging path discharges the voltage on the first output node.

Abstract: A driver includes a low-resistance charging path between a supply voltage rail and a first output node, a high-resistance charging path between the supply voltage rail and the first output node, an inverter coupled to the first output node and configured to enable and disable the low-resistance charging path, and a high-resistance discharging path between the first output node and a second output node. The first output node is coupled to a control terminal of a pass gate transistor in some implementations. The low-resistance charging path charges a voltage on the first output node to a threshold voltage of the pass gate transistor, and the high-resistance charging path charges the voltage on the first output node greater than the threshold voltage of the pass gate transistor. The high-resistance discharging path discharges the voltage on the first output node.

Abstract: A system includes a digital controller in a voltage regulator. The system also includes a passgate array including two or more passgate transistors, where the passgate array is configured to provide a load current to a load, and where the digital controller is configured to activate and deactivate each passgate transistor in the passgate array. The system also includes a feedback loop configured to provide an error signal to the digital controller, the error signal based on a difference between an output voltage of the voltage regulator and a programmed voltage for the voltage regulator. The digital controller is configured to activate or deactivate a passgate transistor based at least in part on the error signal. The digital controller is also configured to activate at least one passgate transistor and deactivate at least one passgate transistor responsive to a clock cycle.

Abstract: An analog-to-digital converter (ADC) includes a digital-to-analog converter (DAC) that has a configurable capacitor array. Based on measurements of differential nonlinearity (DNL) and/or integral nonlinearity (INL) error by an external test computer system, an order for use of the DAC's capacitors can be determined so as to reduce DNL error aggregation, also called INL. The DAC includes a switch matrix that can be programmed by programming data supplied by the test computer system.

Abstract: An analog-to-digital converter (ADC) includes a digital-to-analog converter (DAC) that has a configurable capacitor array. Based on measurements of differential nonlinearity (DNL) and/or integral nonlinearity (INL) error by an external test computer system, an order for use of the DAC's capacitors can be determined so as to reduce DNL error aggregation, also called INL. The DAC includes a switch matrix that can be programmed by programming data supplied by the test computer system.

Abstract: An analog-to-digital converter (ADC) includes a digital-to-analog converter (DAC) that has a configurable capacitor array. Based on measurements of differential nonlinearity (DNL) and/or integral nonlinearity (INL) error by an external test computer system, an order for use of the DAC's capacitors can be determined so as to reduce DNL error aggregation, also called INL. The DAC includes a switch matrix that can be programmed by programming data supplied by the test computer system.

Abstract: An analog-to-digital converter (ADC) includes a digital-to-analog converter (DAC) that has a configurable capacitor array. Based on measurements of differential nonlinearity (DNL) and/or integral nonlinearity (INL) error by an external test computer system, an order for use of the DAC's capacitors can be determined so as to reduce DNL error aggregation, also called INL. The DAC includes a switch matrix that can be programmed by programming data supplied by the test computer system.

Abstract: An analog-to-digital converter (ADC) includes a digital-to-analog converter (DAC) that has a configurable capacitor array. Based on measurements of differential nonlinearity (DNL) and/or integral nonlinearity (INL) error by an external test computer system, an order for use of the DAC's capacitors can be determined so as to reduce DNL error aggregation, also called INL. The DAC includes a switch matrix that can be programmed by programming data supplied by the test computer system.

Abstract: An integrated circuit provides a power on reset signal with respect to a supply voltage level supplying the electronic device. The integrated circuit comprises a bias current generating stage having a first current mirror and an output stage having first, second and third series connected MOS transistors. A connection between the second MOS transistor and the third MOS transistor forms a POR output node. A gate of the second MOS transistor and a gate of the third MOS transistor are coupled to each other and to the first current mirror. This allows a current through the third MOS transistor when the supply voltage is higher than a first MOS transistor threshold and a current through the second MOS transistor only when the supply voltage is greater than or equal to the sum of the first MOS transistor threshold and a second MOS transistor threshold voltage.

Abstract: An integrated circuit provides a power on reset signal with respect to a supply voltage level supplying the electronic device. The integrated circuit comprises a bias current generating stage having a first current mirror and an output stage having first, second and third series connected MOS transistors. A connection between the second MOS transistor and the third MOS transistor forms a POR output node. A gate of the second MOS transistor and a gate of the third MOS transistor are coupled to each other and to the first current mirror. This allows a current through the third MOS transistor when the supply voltage is higher than a first MOS transistor threshold and a current through the second MOS transistor only when the supply voltage is greater than or equal to the sum of the first MOS transistor threshold and a second MOS transistor threshold voltage.

Abstract: An integrated circuit provides a power on reset signal with respect to a supply voltage level supplying the electronic device. The integrated circuit comprises a bias current generating stage having a first current mirror and an output stage having first, second and third series connected MOS transistors. A connection between the second MOS transistor and the third MOS transistor forms a POR output node. A gate of the second MOS transistor and a gate of the third MOS transistor are coupled to each other and to the first current mirror. This allows a current through the third MOS transistor when the supply voltage is higher than a first MOS transistor threshold and a current through the second MOS transistor only when the supply voltage is greater than or equal to the sum of the first MOS transistor threshold and a second MOS transistor threshold voltage.

Abstract: A method for controlling a successive approximation register analog to digital converter comprising connecting a first side of a capacitor to a first comparator input, during a sampling phase connecting the first side of a capacitor to an input and connecting a second side of the capacitor to a mid-voltage, following the sampling phase disconnecting the first side of the capacitor from the input and disconnecting the second side of the capacitor from the mid-voltage and autozeroing the comparator.

Abstract: An integrated circuit provides a power on reset signal with respect to a supply voltage level supplying the electronic device. The integrated circuit comprises a bias current generating stage having a first current mirror and an output stage having first, second and third series connected MOS transistors. A connection between the second MOS transistor and the third MOS transistor forms a POR output node. A gate of the second MOS transistor and a gate of the third MOS transistor are coupled to each other and to the first current mirror. This allows a current through the third MOS transistor when the supply voltage is higher than a first MOS transistor threshold and a current through the second MOS transistor only when the supply voltage is greater than or equal to the sum of the first MOS transistor threshold and a second MOS transistor threshold voltage.

Abstract: A method for controlling a successive approximation register analog to digital converter comprising connecting a first side of a capacitor to a first comparator input, during a sampling phase connecting the first side of a capacitor to an input and connecting a second side of the capacitor to a mid-voltage, following the sampling phase disconnecting the first side of the capacitor from the input and disconnecting the second side of the capacitor from the mid-voltage and autozeroing the comparator.

Abstract: An electronic device with a supply voltage level converter converts a signal from a first low supply voltage level to a second high supply voltage level includes; a first pair of cross coupled MOS transistors compliant with the second supply voltage level, each having a source coupled to the second supply voltage level and providing complementary output signals at respective drains; driven by a second pair of common gate MOS transistors compliant with the second supply voltage; driven by a third pair of common gate MOS transistors compliant with the first voltage level; and driven by first and second inverters coupled in a chain and supplied by the first supply voltage level, each having an output connected to the source of a transistor in a third pair.

Abstract: A charge pump CMOS circuit comprises a differential input stage with two parallel circuit branches. Each of the parallel circuit branches has a diode-connected MOS transistor connected in series with a complementary input MOS transistor. There is a common tail current source for both circuit branches. The diode-connected MOS transistors each have their gate/drain node connected to corresponding current sources. The charge pump CMOS circuit is suitable for use in an oscillator.