Patents by Inventor Bernhardt Schoenlinner

Bernhardt Schoenlinner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8971056
    Abstract: A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together.
    Type: Grant
    Filed: September 18, 2010
    Date of Patent: March 3, 2015
    Assignee: EADS Deutschland GmbH
    Inventors: Heinz-Peter Feldle, Bernhardt Schoenlinner, Ulrich Prechtel, Joerg Sander
  • Publication number: 20120236513
    Abstract: A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together.
    Type: Application
    Filed: September 18, 2010
    Publication date: September 20, 2012
    Applicant: Eads Deutschland GMBH
    Inventors: Heinz-Peter Feldle, Bernhardt Schoenlinner, Ulrich Prechtel, Joerg Sander
  • Publication number: 20110193657
    Abstract: The invention relates to a resonance filter (1) made of silicon for use in the micrometer and millimeter wave length range. Accordingly, a resonance filter having low loss and a high Q-factor is provided, comprising two layers. A first layer thereof carries only resonance cavities and a second layer carries only coupling cavities. Furthermore, a method for the production of the filter according to the invention is provided. This enables the cost-effective production of the resonance filter by means of KOH or TMAH etching technology.
    Type: Application
    Filed: April 7, 2009
    Publication date: August 11, 2011
    Applicant: EADS DEUTSCHLAND GMBH
    Inventors: William Gautier, Bernhardt Schönlinner