Patents by Inventor Bernie YANG

Bernie YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200381405
    Abstract: Certain aspects of the present disclosure generally relate to a chip assembly having an embedded passive device in a bottom package of a package-on-package (PoP) assembly. An example chip assembly generally includes a first package and a second package disposed above and coupled to the first package. The first package may include a redistribution layer, an integrated circuit die disposed above and coupled to the redistribution layer, and at least one reactive component disposed above the redistribution layer and coupled to the redistribution layer and the second package.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 3, 2020
    Inventors: Aniket PATIL, Hong Bok WE, Bernie YANG