Patents by Inventor Bernt Leukel

Bernt Leukel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6507108
    Abstract: The invention relates to a power semiconductor module (10) having a baseplate (1) on which at least one substrate (13) is arranged which is fitted with power semiconductor chips (11, 12) and can be pressed via pressure elements and contact cords (17) against the baseplate (1). The baseplate (1) has centering elements on which a frame (3) which defines fields (7) and is in the form of a grid is provided, with corresponding substrates (13) with power semiconductor chips being arranged in at least some of the fields (7), which substrates (13) can be made contact with via contact rails (15).
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: January 14, 2003
    Assignee: IXYS Semiconductor GmbH
    Inventors: Andreas Lindemann, Bernt Leukel