Patents by Inventor Bert H. Newman

Bert H. Newman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cleavable diepoxide for removable epoxy compositions
    Patent number: 5560934
    Abstract: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: October 1, 1996
    Assignee: International Business Machines Corporation
    Inventors: Ali Afzali-Ardakani, Stephen L. Buchwalter, Jeffrey D. Gelorme, Laura L. Kosbar, Bert H. Newman, Frank L. Pompeo
  • Cleavable diepoxide for removable epoxy compositions
    Patent number: 5512613
    Abstract: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.
    Type: Grant
    Filed: March 18, 1994
    Date of Patent: April 30, 1996
    Assignee: International Business Machines Corporation
    Inventors: Ali Afzali-Ardakani, Stephen L. Buchwalter, Jeffrey D. Gelorme, Laura L. Kosbar, Bert H. Newman, Frank L. Pompeo
  • Process of fabricating a circuit package
    Patent number: 4914814
    Abstract: A low cost process for fabricating solder column interconnectons for an electronic package is described. The process includes the step of filling an array of pin holes in a pin mold with a lead/tin solder, which array of pin holes is in substantial registration with the array of conductive pads on one side of a chip carrier; heating the lead/tin solder in the pin mold such that the solder becomes molten and coalesces with the array of conductive pads of the chip carrier, thereby forming an array of miniature pins bonded to the array of conductive pads of the chip carrier; joining circuit components to the other side of the chip carrier; and reflowing an eutectic lead/tin solder paste screened to the corresponding array of conductive pads of a circuit board to bond the free ends of the array of miniature pins of the carrier to the corresponding array of conductive pads, thereby forming the solder column connnections between the chip carrier and the circuit board.
    Type: Grant
    Filed: May 4, 1989
    Date of Patent: April 10, 1990
    Assignee: International Business Machines Corporation
    Inventors: John R. Behun, William R. Miller, Bert H. Newman, Edward L. Yankowski