Abstract: A thermal transfer system, a heat sink, and a method for transferring heat are provided. The thermal transfer system includes a fuel cell that can produce a fluid. A wick is provided to transfer the fluid to a destination at which a heat source is present. An enclosure having a porous fluid-permeable external wall can surround the fluid at the destination. When the fluid permeates or condenses on the external wall exterior surface, air exposure of that external wall will cause evaporative cooling of the fluid, and thereby enhance the cooling effect at the heat source. The fluid is a natural byproduct of the fuel cell. Accordingly, the thermal transfer system not only cools a heat source, but produces electric current. The heat sink can be thermally coupled to the heat source, and can have a plurality of fins extending from a base. One or more fins can have a fluid-permeable external wall for evaporative cooling.

Abstract: A thermal transfer system, a heat sink, and a method for transferring heat are provided. The thermal transfer system includes a fuel cell that can produce a fluid. A wick is provided to transfer the fluid to a destination at which a heat source is present. An enclosure having a porous fluid-permeable external wall can surround the fluid at the destination. When the fluid permeates or condenses on the external wall exterior surface, air exposure of that external wall will cause evaporative cooling of the fluid, and thereby enhance the cooling effect at the heat source. The fluid is a natural byproduct of the fuel cell. Accordingly, the thermal transfer system not only cools a heat source, but produces electric current. The heat sink can be thermally coupled to the heat source, and can have a plurality of fins extending from a base. One or more fins can have a fluid-permeable external wall for evaporative cooling.

Abstract: A managed memory system is provided. More specifically, in one embodiment, there is provided a system including a memory device and a switch coupled to the memory device. The switch has at least a first switch position and a second switch position. The system also includes a memory controller coupled to the first switch position and a processor interface coupled to the second switch position.

Abstract: A system and method for combining at least two semiconductor die using multi-layer flex circuitry is provided. A first semiconductor die is attached and preferably electrically connected to a first layer of the flex circuitry while a second semiconductor die is set, at least in part, into a window that extends into the flex circuitry to expose a layer of the flex to which the second die is attached. When the second semiconductor die is a flip-chip device, it is connected through its contacts to the layer of flex exposed in the window and when it is a die with its contact side oriented away from the flex circuitry, it is preferably electrically connected with wire bonds to another conductive layer of the flex circuitry. In preferred modules, the first semiconductor die is preferably a flash memory circuit and the second semiconductor die is preferably a controller.