Patents by Inventor Bert HUNDERTMARK

Bert HUNDERTMARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11085844
    Abstract: A pressure transmitter is disclosed. In an embodiment a pressure transmitter includes a housing including a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall, wherein the pressure transmitter is configured to determine differential, relative or absolute pressure.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: August 10, 2021
    Assignee: TDK ELECTRONICS AG
    Inventors: Benjamin Bohl, Jan Ihle, Bert Hundertmark, Bernd Polder, Christian Wohlgemuth
  • Publication number: 20200292401
    Abstract: A pressure sensor is disclosed. In an embodiment a pressure sensor includes a housing comprising a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall.
    Type: Application
    Filed: September 27, 2018
    Publication date: September 17, 2020
    Inventors: Benjamin Bohl, Jan Ihle, Bert Hundertmark, Bernd Polder, Christian Wohlgemuth
  • Publication number: 20200271534
    Abstract: A pressure transmitter is disclosed. In an embodiment a pressure transmitter includes a housing including a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall, wherein the pressure transmitter is configured to determine differential, relative or absolute pressure.
    Type: Application
    Filed: September 27, 2018
    Publication date: August 27, 2020
    Inventors: Benjamin Bohl, Jan Ihle, Bert Hundertmark, Bernd Polder, Christian Wohlgemuth
  • Publication number: 20200256751
    Abstract: A pressure sensor is disclosed. In an embodiment a pressure sensor includes a housing having a housing wall, a sensor element arranged in the housing, a ceramic substrate configured to serve as a support for the sensor element and an electrical connection thereof and a first heating element arranged in an interior of the housing or in the housing wall.
    Type: Application
    Filed: September 27, 2018
    Publication date: August 13, 2020
    Inventors: Benjamin Bohl, Jan Ihle, Bert Hundertmark, Bernd Polder, Christian Wohlgemuth
  • Patent number: 9909946
    Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to ?40° C. and less than or equal to 150° C.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: March 6, 2018
    Assignee: EPCOS AG
    Inventors: Jan Ihle, Andreas Peschka, Bert Hundertmark, Benjamin Bohl, Bernhard Ostrick
  • Publication number: 20170089796
    Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to ?40° C. and less than or equal to 150° C.
    Type: Application
    Filed: December 14, 2016
    Publication date: March 30, 2017
    Inventors: Jan Ihle, Andreas Peschka, Bert Hundertmark, Benjamin Bohl, Bernhard Ostrick
  • Publication number: 20150377734
    Abstract: A pressure sensor system having a pressure sensor chip is specified, which is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to ?40° C. and less than or equal to 150° C.
    Type: Application
    Filed: January 20, 2014
    Publication date: December 31, 2015
    Inventors: Jan IHLE, Andreas PESCHKA, Bert HUNDERTMARK, Benjamin BOHL, Bernhard OSTRICK