Abstract: In a base fabric (2) having a front surface (F) and a back surface (B) at mutually opposite sides with respect to a median lying plane (P), weft yarns (4a, 4b, 4c) interlace with warp yarns (3) at respective interlacing points (IPa, IPb, IPc) at which the weft yarns cross the median lying plane (P) to override at least one of the warp yarns. At least one functional thread (5) extending along a pre-established pattern at the back surface (B) of the base fabric (2), without crossing the median lying plane (P), and is linked with the weft yarns (4a, 4b, 4c) at stitching points (SP) positioned between the median lying plane (P) and the back surface (B) of the base fabric (2), so that the stitching points (SP) are not visible from a front surface (F) opposite to the back surface (B).

Abstract: In a base fabric (2) having a front surface (F) and a back surface (B) at mutually opposite sides with respect to a median lying plane (P), weft yarns (4a, 4b, 4c) interlace with warp yarns (3) at respective interlacing points (IPa, IPb, IPc) at which the weft yarns cross the median lying plane (P) to override at least one of the warp yarns. At least one functional thread (5) extending along a pre-established pattern at the back surface (B) of the base fabric (2), without crossing the median lying plane (P), and is linked with the weft yarns (4a, 4b, 4c) at stitching points (SP) positioned between the median lying plane (P) and the back surface (B) of the base fabric (2), so that the stitching points (SP) are not visible from a front surface (F) opposite to the back surface (B).

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.