Abstract: A memory includes a plurality of memory cells each including a true data input connected to a true bit line and complementary data input connected to a complementary bit line, and two inverters connected head-to-tail firstly to the true data input and secondly to the complementary data input. The memory also includes a test circuit includes a plurality of test cells, each test cell includes a true data input connected to a complementary data input of the preceding test cell and a complementary data input connected to the true data input of the following test cell, the complementary data input of the last test cell being connected to the true data input of the first test cell, each test cell comprising a first inverter connected between the true data input and the complementary data input. The looped chain thus formed propagates a signal whose period is a function of the performance of the storage cells.

Abstract: A measuring circuit is provided for a memory integrated within a semiconductor device. The measuring circuit includes initializing means and an oscillating loop. The initializing means loadings two complementary values into at least two locations of the memory. The two locations are addressed by a first address and a second address. The oscillating loop comprises a logic circuit for alternatively generating the first address and the second address from data read from the memory so as to successively read data from the first and second memory locations to produce an oscillating signal that has a frequency that depends on internal parameters of the memory. Also provided is a method for qualifying a memory by initializing the memory by loading two complementary values into two locations, and generating an oscillating signal with a frequency that is dependent on internal parameters of the memory.

Abstract: An anti-fuse cell includes a standard MOS transistor of an integrated circuit, with source and drain regions covered with a metal silicide layer and at least one track of a resistive layer at least partially surrounding the MOS transistor, and adapted to pass a heating current such that the metal of said metal silicide diffuses across drain and/or source junctions.

Abstract: A semiconductor device is provided that includes a plurality of patterns. Each pattern includes at least one field effect transistor. Each field effect transistor includes a source region, a drain region, a channel region, and a gate region formed above the channel region. A portion of the plurality of patterns is formed in a single active area of a semiconductor substrate, where the area delimited by an isolation region. One of the source region and the drain region of each adjacent pattern are formed in said active area.

Abstract: An integrated circuit includes N configurable cells each including one functional input, one output, one propagation input and one output. The circuit includes a functional mode in which the N configurable cells are coupled by their functional input and their output to logic blocks with which they cooperate to form at least one logic circuit. The disclosed circuit also includes a test mode in which the N configurable cells are coupled by their propagation input and their output to the logic blocks and in which the output of the Nth configurable cell is coupled to a functional input of the first logic block to form an oscillator.

Abstract: A method for forming a resistor of high value in a semiconductor substrate including forming a stack of a first insulating layer, a first conductive layer, a second insulating layer, and a third insulating layer, the third insulating layer being selectively etchable with respect to the second insulating layer; etching the stack, to expose the substrate and keep the stack in the form of a line; forming insulating spacers on the lateral walls of the line; performing an epitaxial growth of a single-crystal semiconductor on the substrate, on either side of the line; selectively removing the third insulating layer to partially expose the second insulating layer at a predetermined location; and depositing and etching a conductive material to fill the cavity formed by the previous removal of the third insulating layer.

Abstract: A measuring circuit is provided for a memory integrated within a semiconductor device. The measuring circuit includes initializing means and an oscillating loop. The initializing means loadings two complementary values into at least two locations of the memory. The two locations are addressed by a first address and a second address. The oscillating loop comprises a logic circuit for alternatively generating the first address and the second address from data read from the memory so as to successively read data from the first and second memory locations to produce an oscillating signal that has a frequency that depends on internal parameters of the memory. Also provided is a method for qualifying a memory by initializing the memory by loading two complementary values into two locations, and generating an oscillating signal with a frequency that is dependent on internal parameters of the memory.

Abstract: An integrated circuit memory of the read-only memory type includes at least one memory cell. Each memory cell includes a storage transistor realized in a semiconductor substrate and presenting a source connected to a reference potential, a gate connected to an electrically conductive word line, and a drain connected to an electrically conductive bit line by an optional connection depending on whether the memory cell is assigned the value 0 or 1. The storage transistor of each memory cell includes a gate formed on the substrate, in the form of a window whose inner contour delimits a central drain region in the substrate, and whose outer contour delimits at least one source region in the substrate.

Abstract: An SRAM cell with four transistors and two resistors formed in a semiconductor substrate, the transistors being formed in pairs in two active regions of the substrate, the resistors being formed by leakage capacitors, a first electrode of the capacitors being common and formed of a high supply line of the cell buried in an area separating the active regions.

Abstract: A method for forming a resistor of high value in a semiconductor substrate including forming a stack of a first insulating layer, a first conductive layer, a second insulating layer, and a third insulating layer, the third insulating layer being selectively etchable with respect to the second insulating layer; etching the stack, to expose the substrate and keep the stack in the form of a line; forming insulating spacers on the lateral walls of the line; performing an epitaxial growth of a single-crystal semiconductor on the substrate, on either side of the line; selectively removing the third insulating layer to partially expose the second insulating layer at a predetermined location; and depositing and etching a conductive material to fill the cavity formed by the previous removal of the third insulating layer.

Abstract: A ROM including memory cells, the programmed cells being formed of a transistor connected between a bit line and a supply potential, the cells being organized in sets of at least one column coupled to one sense amplifier per set. The cell programming is inverted with respect to a desired programming only in specific sets where the desired programming would result in a number of programmed cells greater than the number of unprogrammed cells, the logic state provided by the sense amplifiers associated with the specific sets being inverted.

Abstract: A ROM including columns of memory cells connected by columns to respective bit lines; a reference bit line; charge transistors controllable by a common charge line and respectively connecting the bit lines and the reference bit line to a high supply potential. The reference bit line is associated with a column of unprogrammed cells, and the memory includes means for activating the charge line before activation of a word line, the duration between the activation of the charge line and the activation of the word line, and the features of the charge transistors, being chosen so that the level variation of the bit lines is low as compared to the level of the high supply potential.