Abstract: A method for calibrating an inertial angular sensor, includes the steps of: A for at least two electrical angles (?j) of the vibration wave: A1 applying, via each of the three trim controls CTi, a sinusoidal stiffness disturbance PSi having a disturbance frequency fi, and for each applied disturbance: A11 determining and storing an estimated excitation force Fei to be applied to the resonator in the presence of said disturbance PSi, on the basis of excitation controls determined by the servo controls, B determining, on the basis of the three estimated excitation forces Fei i=1, 2, 3 stored in step A11, three 2×2 matrices M?i, a matrix M?i being representative of the response of the gyrometer to the disturbance PSi, C determining and storing an estimated inverse excitation matrix (formula (A)) and an estimated inverse detection matrix (formula (B)) on the basis of the three matrices M?i determined in step B, an excitation matrix E and a detection matrix D being respectively representative of the effects of the

Abstract: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane. The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

Abstract: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane. The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

Abstract: A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.

Abstract: A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.

Abstract: A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in X and Y and coupled together by identical stiffness springs in X and Y, and at least excitation transducers and detection transducers disposed on at least one of the masses. The mobile assembly consisting of a vibrating mass and the parts of transducers fastened to this mass has a generally symmetric structure with respect to an axis of symmetry OX and with respect to an axis of symmetry OY.

Abstract: The micro-electro-mechanical system is provided with at least two separate anchoring elements (F1, F2) designed to be bound to a support. A anchoring element (F1, F2) is solidly linked to at least one beam (P1, P2) that can be deformed in bending, and two beams (P1, P2) respectively linked to two distinct anchoring elements (F1, F2) have different directions. A beam has a length L, a thickness e, and a height h, such that the stiffnesses KL in the directions of the length and of the height Kh are large and the stiffness in the direction of the thickness Ke is small.

Abstract: A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in X and Y and coupled together by identical stiffness springs in X and Y, and at least excitation transducers and detection transducers disposed on at least one of the masses. The mobile assembly consisting of a vibrating mass and the parts of transducers fastened to this mass has a generally symmetric structure with respect to an axis of symmetry OX and with respect to an axis of symmetry OY.

Abstract: A gyroscope having a vibrating structure, produced by micromachining in a thin planar wafer, the gyroscope including two symmetrical moving assemblies that are coupled by a coupling structure connecting the two assemblies so as to allow mechanical vibration energy to be transferred between them, each moving assembly including a first moving element connected to the coupling structure and able to vibrate with two degrees of freedom in orthogonal directions Ox and Oy of the plane of the wafer, and a second moving element adjacent the first moving element, capable of vibrating only in the Oy direction and connected to the first moving element via linkage element, wherein the linkage element allow the transmission, in phase opposition, to the second moving element of the vibration movement of the first moving element in the Oy direction.

Abstract: Package (BT) for vacuum encapsulation of a microelectromechanical system (MEMS) provided with an electrically conductive element intended to be soldered to said package (BT), said package (BT) comprising a metallized base (FM), designed to be soldered to said microelectromechanical system (MEMS), and output electrical contacts (CES), electrically connected to electrical-contact elements of said microelectromechanical system. Said metallized base (FM) comprises a plurality of metallized surface portions (PSM), respectively bounded by an unmetallized solder stop region, and respectively connected to the rest of the metallized base (FM) by a metallized track (PTEM), having a small width relative to the corresponding width of said portion (PSM), said metallized surface portions (PSM) being designed to be soldered to said microelectromechanical system (MEMS).

Abstract: The micro-electro-mechanical system is provided with at least two separate anchoring elements (F1, F2) designed to be bound to a support. A anchoring element (F1, F2) is solidly linked to at least one beam (P1, P2) that can be deformed in bending, and two beams (P1, P2) respectively linked to two distinct anchoring elements (F1, F2) have different directions. A beam has a length L, a thickness e, and a height h, such that the stiffnesses KL in the directions of the length and of the height Kh are large and the stiffness in the direction of the thickness Ke is small.

Abstract: A gyroscope having a vibrating structure, produced by micromachining in a thin planar wafer, said gyroscope including two symmetrical moving assemblies that are coupled by a coupling structure connecting the two assemblies so as to allow mechanical vibration energy to be transferred between them, each moving assembly including a first moving element connected to the coupling structure and able to vibrate with two degrees of freedom in orthogonal directions Ox and Oy of the plane of the wafer, and a second moving element adjacent the first moving element, capable of vibrating only in the Oy direction and connected to the first moving element via linkage means, wherein the linkage means allow the transmission, in phase opposition, to the second moving element of the vibration movement of the first moving element in the Oy direction.

Abstract: Package (BT) for vacuum encapsulation of a microelectromechanical system (MEMS) provided with an electrically conductive element intended to be soldered to said package (BT), said package (BT) comprising a metallized base (FM), designed to be soldered to said microelectromechanical system (MEMS), and output electrical contacts (CES), electrically connected to electrical-contact elements of said microelectromechanical system. Said metallized base (FM) comprises a plurality of metallized surface portions (PSM), respectively bounded by an unmetallized solder stop region, and respectively connected to the rest of the metallized base (FM) by a metallized track (PTEM), having a small width relative to the corresponding width of said portion (PSM), said metallized surface portions (PSM) being designed to be soldered to said microelectromechanical system (MEMS).

Abstract: The invention relates to a device and a method for detecting a fault in a measurement device comprising a resonator and means for measuring a resonant frequency of the resonator. According to the invention, the device further includes means delivering information (S3) representative of the quality factor of the resonator (3) at the resonant frequency.

Abstract: The invention relates to a device and a method for detecting a fault in a measurement device comprising a resonator and means for measuring a resonant frequency of the resonator. According to the invention, the device further includes means delivering information (S3) representative of the quality factor of the resonator (3) at the resonant frequency.

Abstract: The invention relates to a gyrometer based on a vibrating structure, produced by micromachining in a thin planar wafer. It comprises four moving assemblies placed at the vertices of a virtual rectangle, each moving assembly being coupled to two moving assemblies located at neighboring vertices via a coupling structure and comprising an inertial first moving element connected to the coupling structure and intended to vibrate in two orthogonal directions in the plane of the wafer, namely an excitation direction and a detection direction, and a second moving element intended to vibrate in the detection direction and connected, on one side, to the first moving element and, on the other side, to anchoring zones via linking means.

Abstract: The invention relates to a micromachined gyrometer having a planar moving structure anchored on a fixed substrate by anchoring feet, the fixed substrate being mounted on a support substrate via fasteners, the moving structure comprising at least two moving assemblies that are symmetrical with respect to an axis of symmetry A1; the anchoring feet are located outside this axis A1. The fixed substrate has etched features for the purpose of partly isolating at least one region from the rest of the fixed substrate, this region having a portion of the fixed substrate that includes at least one anchoring foot, and the fixed substrate is mounted on the support substrate via fasteners applied outside the region.

Abstract: The invention relates to gyroscopes having a vibrating structure that is micromachined in a silicon substrate. A novel vibrating structure is described, which has two moving masses 14 and 14?, connected by a vibration energy coupling structure (transverse arms 26, 26?, longitudinal arms 22, 22?, and a short transverse link 24 between the longitudinal links 22, 22?). The moving masses are also suspended from U-shaped flexure arms (13), having one branch end connected to the mass and another end connected to a fixed anchoring point 18. The flexure arms are not inserted between the coupling structure and the mass, but are independent of the coupling structure. The masses are excited so as to vibrate in their plane by electrostatic forces applied by interdigitated combs 11. The Coriolis forces make them vibrate perpendicular to the plane, and this vibration is detected by electrodes forming part of the moving masses.

Abstract: The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques on a silicon wafer. The gyroscope comprises two symmetrical moving assemblies coupled via a coupling structure. Each of the two assemblies comprises a moving mass surrounded by a moving intermediate frame. The frame is connected to the coupling structure and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy in the plane of the wafer. The mass is connected on one side to the frame and on the other side to fixed anchoring regions via linking means that allow the vibration movement along the Oy direction to be transmitted to the mass without permitting movement of the mass along the Ox direction. An excitation structure is associated with the frame in order to excite its vibration along Ox. A movement detection structure is associated with the mass in order to detect its vibration along Oy.

Abstract: The invention relates to a differential accelerometer micromachined in a plane plate, comprising a base and a differential measurement cell which includes a moveable seismic mass and two force sensors that are connected to the mass and to the base.