Abstract: A method of sealing a glass assembly includes contacting a first glass substrate with a first metal foil to create a first contact location; directing a laser beam on a second surface of the first metal foil opposite the first contact location to bond the first glass substrate to the first metal foil and form a first bond location; rotating the glass assembly 180 degrees about a longitudinal axis of the glass assembly; contacting a second glass substrate with a second metal foil to create a second contact location; and directing the laser beam on a second surface of the second metal foil opposite the second contact location to bond the second glass substrate to the second metal foil and form a second bond location.

Abstract: A method of preparing a workpiece for laser bonding includes positioning a first metal gasket on a fixture; positioning a first surface of a substrate on the first metal gasket, wherein the fixture, the first metal gasket and the first surface of the substrate define a first cavity; applying a vacuum to the first cavity, the vacuum pulling the substrate against the first metal gasket; and directing a laser at an interface of the first metal gasket and the first surface of the substrate, wherein the laser forms a bond between the first metal gasket and the first surface of the substrate.

Abstract: Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

Abstract: Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

Abstract: A fiber splicing apparatus of the present invention includes a support (120a, 120b) for supporting the two optical fibers (112a,112b) such that the ends (114a, 114b) thereof are aligned and in physical contact, and a laser (130) emitting a laser beam (142) onto the ends of the optical fibers to heat and thereby fuse together the ends (114a, 114b ) of the fibers (112a, 112b). According to another embodiment, an apparatus is provided for heating a region (115) of one or more optical fibers(112a, 112b). This apparatus includes a laser (130) emitting a laser beam (132) and an optical modulator (134) positioned to receive and selectively modulate the intensity of the laser beam (132) to project a modulated laser beam (138) along a first optical path that terminates at the end (114a, 114b ) of the optical fiber(s) (112a, 112b)to be heated.

Abstract: An optical switch is provided. The optical switch includes a substrate having a first surface and a second surface. At least one optical waveguide is formed below the first surface of the substrate. A heating element is disposed on the first surface of the substrate. The heating element is also disposed in proximity to the at least one optical waveguide. A cavity is formed in the second surface of the substrate. The cavity is also disposed in the proximity to the at least one optical waveguide. A heat conductive material is disposed within the cavity.

Abstract: A method of coupling at least two planar optical devices that includes the steps of aligning a first optical device having a substrate and at least one waveguide to a second optical device having a substrate and at least one waveguide such that the optical devices have aligned waveguides, and abutting the aligned waveguides of the first and second optical devices. The method further includes coupling the respective substrates of the optical devices together, and fusing the optical waveguide of the first optical device to the optical waveguide of the second optical device.

Abstract: A fusion joint between a waveguide (1a) and an optical fiber (2) is created by irradiating the interface (4) between the optical fiber and the waveguide using a laser beam. The spatial distribution of the energy furnished to the interface presents a central zone of which the energy is reduced with respect to a peripheral zone, whereby to enable a relatively high energy laser to be used while avoiding bending of the waveguide. The laser beam is caused to irradiate a higher energy density upon the waveguide than the optical fiber, typically by offsetting the center of the laser beam towards the waveguide. The fusion is performed while a force F urges the waveguide and optical fiber towards one another, so as to avoid the creation of a void at the boundary. A supplementary polymer or mineral joint can be provided.

Abstract: An optical switch is provided. The optical switch includes a substrate having a first surface and a second surface. At least one optical waveguide is formed below the first surface of the substrate. A heating element is disposed on the first surface of the substrate. The heating element is also disposed in proximity to the at least one optical waveguide. A cavity is formed in the second surface of the substrate. The cavity is also disposed in the proximity to the at least one optical waveguide. A heat conductive material is disposed within the cavity.

Abstract: 1A fiber splicing apparatus of the present invention includes a support (120a, 120b) for supporting the two optical fibers (112a,112b) such that the ends (114a, 114b) thereof are aligned and in physical contact, and a laser (130) emitting a laser beam (142) onto the ends of the optical fibers to heat and thereby fuse together the ends (114a, 114b ) of the fibers (112a, 112b). According to another embodiment, an apparatus is provided for heating a region (115) of one or more optical fibers(112a, 112b). This apparatus includes a laser (130) emitting a laser beam (132) and an optical modulator (134) positioned to receive and selectively modulate the intensity of the laser beam (132) to project a modulated laser beam (138) along a first optical path that terminates at the end (114a, 114b ) of the optical fiber(s) (112a, 112b)to be heated.

Abstract: A method and structure for the mechanical and optical coupling of a plurality of individual planar optical devices (10, 20) to one another includes aligning the devices, bonding (35, 37, 38) the substrates (12, 22) of the planar devices (10, 20) to one another and subsequently fusing (40, 42, 44, 46) aligned optical waveguides (11, 29) utilizing a heat fusion technique. The substrates (12, 22) are bonded utilizing either heat fusion for a silica substrate or by a bonding adhesive for a silicon substrate. Once the aligned substrates (12, 22) have been mechanically bonded to one another, the optical pathways (11, 29) are coupled in one embodiment by heat fusion, preferably a focused CO2 laser (30) which completes the mechanical and optical interconnection of multiple devices. It is possible with such alignment, bonding, and fusion processes to couple numerous planar optical devices (10, 20, 50) in an array which can subsequently be packaged for use in relatively complex optical networks.

Abstract: An optical fiber is interfaced with an optical device formed on a substrate. The substrate includes a groove under and behind an interface between the optical fiber and the optical device. Provision of such a groove allows the substrate to be used for alignment and support of the optical fiber, while reducing fusion loss and improving durability of the interface. Steps for facilitating alignment may be provided in the substrate. Solder may be used to further improve durability of the interfaced structure.

Abstract: A device, utilized for the separation or combination of two signals of different wavelengths, of the type in which the waveguides comprise straight interaction segments (1.sub.1, 2.sub.1 ; 1.sub.in, 2.sub.in) parallel and close to one another and to curved approach segments with inflection points (1.sub.2, 2.sub.2, 1.sub.3, 2.sub.3 ; 1.sub.2n, 2.sub.2n, 1.sub.3n, 2.sub.3n), connected to the ends of the straight segments, and, for certain ones, to inputs/outputs (4,5,6) of the device. In accordance with the invention, the approach segments situated on at least the same side of the straight segments are free of any inflection point, the coupling of the straight segments being optionally modified to compensate for the variation of the coupling between the waveguides along said approach segments due to the omission of the inflection points.

Abstract: A device, utilized for the separation or combination of two signals of different wavelengths, of the type in which the waveguides comprise straight interaction segments (1.sub.1, 2.sub.1 ; 1.sub.1n, 2.sub.1n) parallel and close to one another and to curved approach segments with inflection points (1.sub.2, 2.sub.2, 1.sub.3, 2.sub.3 ; 1.sub.2n, 2.sub.2n, 1.sub.3n, 2.sub.3n), connected to the ends of the straight segments, and, for certain ones, to inputs/outputs (4, 5, 6) of the device. In accordance with the invention, the approach segments situated on at least the same side of the straight segments are free of any inflection point, the coupling of the straight segments being optionally modified to compensate for the variation of the coupling between the waveguides along said approach segments due to the omission of the inflection points.