Patents by Inventor Beryl Blondeau

Beryl Blondeau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials
    Patent number: 6991944
    Abstract: This invention relates to a process for treatment of a multi-layer wafer with materials having differential thermal characteristics, the process comprising a high temperature heat treatment step that can generate secondary defects, characterised in that this process includes a wafer surface preparation step before the high temperature heat treatment step.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: January 31, 2006
    Assignees: S.O.I.Tec Silicon on Insulation Technologies S.A., Commissariat à l'Energie Atomique (CEA)
    Inventors: Olivier Rayssac, Beryl Blondeau, Hubert Moriceau, Christelle Lagahe-Blanchard, Franck Fournel
  • Method for improving the quality of heterostructure
    Publication number: 20050130393
    Abstract: A method for improving the quality of a heterostructure that includes at least two layers of material that have different thermal expansion coefficients is described. The method includes applying a cap layer to the exposed surface of at least one of the layers. The cap layer is made of a material and has a thickness sufficient to reduce defects in at least one of the two layers during subsequent thermal treatment of the heterostructure. The present technique is a reliable and effective method for improving the quality of a heterostructure.
    Type: Application
    Filed: May 5, 2004
    Publication date: June 16, 2005
    Inventors: Beryl Blondeau, Ian Cayrefourcq, Eric Guiot, Thibaut Maurice, Hubert Moriceau
  • Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials
    Publication number: 20050130429
    Abstract: This invention relates to a process for treatment of a multi-layer wafer with materials having differential thermal characteristics, the process comprising a high temperature heat treatment step that can generate secondary defects, characterised in that this process includes a wafer surface preparation step before the high temperature heat treatment step.
    Type: Application
    Filed: August 10, 2004
    Publication date: June 16, 2005
    Inventors: Olivier Rayssac, Beryl Blondeau, Hubert Moriceau, Christelle Lagahe-Blanchard, Franck Fournel
  • Preparation method for protecting the back surface of a wafer and back surface protected wafer
    Publication number: 20040241461
    Abstract: The present invention relates to the preparation of a wafer that has front and back surfaces that are suitable for use in optical, electronic, opto electronic or micro mechanical devices. The wafer preparation method includes the improvement which comprises applying a cap layer proximate to at least a portion of the back surface of the wafer to facilitate handling of the wafer while protecting at least the back surface portion from damage. Advantageously, the cap layer can be applied proximate to the entire back surface of the wafer and along at least a portion of a side of the wafer that extends between the surfaces to fully protect the back surface of the wafer from damage during handling. In another embodiment, the method further comprises applying a top layer proximate to at least a portion of the front surface of the wafer.
    Type: Application
    Filed: November 18, 2003
    Publication date: December 2, 2004
    Inventors: Thibaut Maurice, Beryl Blondeau