Abstract: A computer system comprising a motherboard and a power supply having an associated power management bus controller with memory storing the power capacity of the associated power supply. A power circuit provides power from the power supply to the motherboard, wherein the motherboard has a processor and a baseboard management controller. The system further comprises a power management bus providing communication between the baseboard management controller and the power management bus controller associated with the selected power supply, wherein the power management bus controller provides the stored power capacity to the baseboard management controller. This allows the baseboard management controller to limit operation of the processor to control the amount of power consumed from exceeding the power capacity of the selected power supply. The power capacity of the power supply may be sent to the baseboard management controller in response to booting the motherboard.

Abstract: A computer system comprising a motherboard and a power supply having an associated power management bus controller with memory storing the power capacity of the associated power supply. A power circuit provides power from the power supply to the motherboard, wherein the motherboard has a processor and a baseboard management controller. The system further comprises a power management bus providing communication between the baseboard management controller and the power management bus controller associated with the selected power supply, wherein the power management bus controller provides the stored power capacity to the baseboard management controller. This allows the baseboard management controller to limit operation of the processor to control the amount of power consumed from exceeding the power capacity of the selected power supply. The power capacity of the power supply may be sent to the baseboard management controller in response to booting the motherboard.

Abstract: A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

Abstract: An acoustic and thermal energy management system and method comprising a microprocessor and a thermal mass positioned at a distance from the microprocessor, the microprocessor and thermal mass being thermally connected to the microprocessor in a manner to transfer thermal energy from the microprocessor to the thermal mass. The acoustic and thermal energy management system transferring heat from the microprocessor to a thermal mass for dissipation reducing the level of heat at the microprocessor, thereby limiting the operation of or the operation level of a fan.

Abstract: A device for use in cooling a microelectronic component in a data processing system with a heat sink and a fan. The device includes means for maintaining the fan in close proximity to the heat sink and in a position relative to the fan for moving air over cooling surfaces of the heat sink and component to vibrationally isolate the fan from the heat sink and reduce the transmission of fan vibration to the heat sink. In one embodiment, the vibration isolation component is also configured to receive the fan and secure the fan in position relative to the heat sink to locate the fan in a predetermined position relative to the heat sink. In another embodiment, the vibration isolation component comprises a compliant gasket defining an opening adapted to receive an active area of the fan to allow air flow generated by the fan to reach the heat sink.

Abstract: A device for use in cooling a microelectronic component in a data processing system with a heat sink and a fan. The device includes means for maintaining the fan in close proximity to the heat sink and in a position relative to the fan for moving air over cooling surfaces of the heat sink and component to vibrationally isolate the fan from the heat sink and reduce the transmission of fan vibration to the heat sink. In one embodiment, the vibration isolation component is also configured to receive the fan and secure the fan in position relative to the heat sink to locate the fan in a predetermined position relative to the heat sink. In another embodiment, the vibration isolation component comprises a compliant gasket defining an opening adapted to receive an active area of the fan to allow air flow generated by the fan to reach the heat sink.

Abstract: A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.

Abstract: A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.

Abstract: A system for cooling a component in a computer system is disclosed. The system comprises a socket for receiving the component and for coupling the component to a planar. A heat dissipating element is coupled to the component and to the socket via a plurality of socket tabs coupled to the socket. At least two socket tabs include an embedded reinforcing strip which extends from the socket. A further aspect of the present invention provides securing the socket to the planar by extending the reinforcing strip from each of the at least two socket tabs through the socket and out of a bottom surface of the socket, and coupling the reinforcing strip from each of the at least two socket tabs to the planar.

Abstract: A heat sink retention assembly including a spring, a spring retainer, and a spring displacement limiter. The spring retainer maintains the spring in a compressed state in which a contact portion of the spring applies a force to the heat sink. The compressed state is characterized by a predetermined spring displacement and exerted force. The spring displacement limiting mechanism prevents displacement of the compressed spring substantially beyond the predetermined spring displacement. The displacement limiting mechanism may comprise a separate component such as a spacer structure or may be integrated into the configuration of the spring itself. In one spacer structure embodiment, the spacer has a vertical dimension that is determined by the difference between the total spring displacement possible and the predetermined spring displacement required to deliver the predetermined force to the heat sink.

Abstract: A heat sink retention assembly including a spring, a spring retainer, and a spring displacement limiter. The spring retainer maintains the spring in a compressed state in which a contact portion of the spring applies a force to the heat sink. The compressed state is characterized by a predetermined spring displacement and exerted force. The spring displacement limiting mechanism prevents displacement of the compressed spring substantially beyond the predetermined spring displacement. The displacement limiting mechanism may comprise a separate component such as a spacer structure or may be integrated into the configuration of the spring itself. In one spacer structure embodiment, the spacer has a vertical dimension that is determined by the difference between the total spring displacement possible and the predetermined spring displacement required to deliver the predetermined force to the heat sink.

Abstract: A system for cooling a component in a computer system is disclosed. The system comprises a socket for receiving the component and for coupling the component to a planar. A heat dissipating element is coupled to the component and to the socket via a plurality of socket tabs coupled to the socket. At least two socket tabs include an embedded reinforcing strip which extends from the socket. A further aspect of the present invention provides securing the socket to the planar by extending the reinforcing strip from each of the at least two socket tabs through the socket and out of a bottom surface of the socket, and coupling the reinforcing strip from each of the at least two socket tabs to the planar.

Abstract: A fastening mechanism for installing a processor heatsink on a planar board space takes up a minimal amount of the planar board space. The heatsink is held down securely against the top of the processor with a substantial amount of force. This is accomplished through a screw and leaf spring mechanism at each side edge of the processor. The screw and leaf spring arrangement are rotated out of the way while the heatsink is installed and then returned to their original positions to retain the heatsink. The mechanism is partially assembled prior to the installation of the heatsink.