Patents by Inventor Beth M. Eichler-Johnson

Beth M. Eichler-Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10619081
    Abstract: A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melt temperature of at least 70° C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: April 14, 2020
    Assignee: H.B. Fuller Company
    Inventors: Beth M. Eichler-Johnson, Thomas F. Kauffman, James E. Welton, Andrew R. Michel
  • Publication number: 20180334597
    Abstract: A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melting point of at least 70° C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.
    Type: Application
    Filed: May 22, 2018
    Publication date: November 22, 2018
    Inventors: Beth M. Eichler-Johnson, Thomas F. Kauffma, James E. Welton, Andrew R. Michel
  • Publication number: 20150259578
    Abstract: Disclosed is a hot melt adhesive composition that includes a polymer component that includes a propylene polymer that includes greater than 50 mole % propylene and exhibiting a melt index greater than 150 grams per ten minutes at 190° C., and an ethylene copolymer exhibiting a melt index of at least 200 grams per ten minutes at 190° C. and an acid number of no greater than 2 mg KOH/g, and derived from ethylene and a co-monomer selected from the group consisting of vinyl acetate, alkyl acrylate, alkyl methacrylate, and combinations thereof, from 0% by weight to no greater than 8% by weight amorphous polyalphaolefin, and from 0% by weight to no greater than 25% by weight oil.
    Type: Application
    Filed: March 5, 2015
    Publication date: September 17, 2015
    Inventors: Cheryl A. Jones, Kim Larson, Ameara S. Mansour, Kevin P. Burge, Beth M. Eichler-Johnson
  • Patent number: 8110623
    Abstract: A hot melt pressure-sensitive adhesive composition that includes thermoplastic polymer, tackifying agent, plasticizer oil, and from at least 5% by weight to about 25% by weight vegetable wax.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: February 7, 2012
    Assignee: H.B. Fuller Company
    Inventors: Sharf U. Ahmed, Steven R. Vaughan, Vitaly Rogachevsky, Beth M. Eichler-Johnson
  • Publication number: 20080076860
    Abstract: A hot melt pressure-sensitive adhesive composition that includes thermoplastic polymer, tackifying agent, plasticizer oil, and from at least 5% by weight to about 25% by weight vegetable wax.
    Type: Application
    Filed: September 27, 2007
    Publication date: March 27, 2008
    Applicant: H.B. FULLER LICENSING & FINANCING, INC.
    Inventors: Sharf U. Ahmed, Steven R. Vaughan, Vitaly Rogachevsky, Beth M. Eichler-Johnson
  • Patent number: 6833404
    Abstract: This invention relates to an improved hot melt adhesive comprising a tackifying resin wherein the resin is substantially aliphatic and has a glass transition temperature of greater than 65° C. and a thermoplastic polymer.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: December 21, 2004
    Assignee: H.B. Fuller Licensing & Financing Inc.
    Inventors: Thomas H. Quinn, Steven W. Albrecht, Beth M. Eichler-Johnson, David B. Malcolm, Lisa L. Ryan
  • Publication number: 20030139516
    Abstract: This invention relates to an improved hot melt adhesive comprising a tackifying resin wherein the resin is substantially aliphatic and has a glass transition temperature of greater than 65° C. and a thermoplastic polymer.
    Type: Application
    Filed: April 27, 1999
    Publication date: July 24, 2003
    Inventors: THOMAS H. QUINN, STEVEN W. ALBRECHT, BETH M. EICHLER-JOHNSON, DAVID B. MALCOLM, LISA L. RYAN
  • Patent number: 6582829
    Abstract: A hot melt adhesive composition comprising a) from about 5 wt-% to about 50 wt-% of at least one homogeneous linear or substantially linear ethylene/alpha-olefin interpolymer characterized as having a density from 0.850 to 0.965 g/cm3; b) from about 1 wt-% to about 40 wt-% of at least one block copolymer; and c) from about 10 wt-% to about 75 wt-% of at least one tackifying resin wherein said adhesive does not fail cohesively.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: June 24, 2003
    Assignee: H.B. Fuller Licensing & Financing Inc.
    Inventors: Thomas H. Quinn, Janelle C. Cameron, Beth M. Eichler-Johnson, Michael S. Keehr, Jeffrey S. Lindquist, David B. Malcolm, Kevin W. McKay, Deepak R. Parikh