Abstract: Embodiments include an electronic system and methods of forming an electronic system. In an embodiment, the electronic system may include a package substrate and a die coupled to the package substrate. In an embodiment, the electronic system may also include an integrated heat spreader (IHS) that is coupled to the package substrate. In an embodiment the electronic system may further comprise a thermal interface pad between the IHS and the die. In an embodiment the die is thermally coupled to the IHS by a liquid metal thermal interface material (TIM) that contacts the thermal interface pad.

Abstract: Techniques and mechanisms for enabling a flow of fluid through microchannels of a fluid conduit, which is thermally coupled to cool integrated circuitry. In an embodiment, sidewall structures of the fluid conduit extend from a base structure to form at least in part microchannels, which extend along the base structure. The sidewall structures accommodate a flow of a coolant fluid through the fluid conduit, where the flow in turn facilitates conduction of heat, which has been transferred to the fluid conduit from the integrated circuitry. The sidewall structures comprise pores, which extend through a corresponding sidewall structure between two microchannel regions. In another embodiment, a sidewall structure provides a gradient of average porosity along one or more dimensions.

Abstract: Embodiments include an electronic system and methods of forming an electronic system. In an embodiment, the electronic system may include a package substrate and a die coupled to the package substrate. In an embodiment, the electronic system may also include an integrated heat spreader (IHS) that is coupled to the package substrate. In an embodiment the electronic system may further comprise a thermal interface pad between the IHS and the die. In an embodiment the die is thermally coupled to the IHS by a liquid metal thermal interface material (TIM) that contacts the thermal interface pad.