Patents by Inventor Betsegaw Kebede Gebrehiwot

Betsegaw Kebede Gebrehiwot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal assemblies for multi-chip packages
    Patent number: 11456232
    Abstract: Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: September 27, 2022
    Assignee: Intel Corporation
    Inventors: Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw Kebede Gebrehiwot, Chandra Mohan Jha
  • THERMAL ASSEMBLIES FOR MULTI-CHIP PACKAGES
    Publication number: 20200051894
    Abstract: Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.
    Type: Application
    Filed: August 10, 2018
    Publication date: February 13, 2020
    Applicant: Intel Corporation
    Inventors: Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw Kebede Gebrehiwot, Chandra Mohan Jha