Patents by Inventor Bettina A. Dinkel

Bettina A. Dinkel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soft passivation layer in semiconductor fabrication
    Patent number: 6127721
    Abstract: The use of an etch stop layer to define a terminal via opening to access a device feature after formation of a photosensitive soft-passivation layer. The etch stop layer allows the size of the terminal via opening to be decoupled from the resolution capabilities of current photosensitive soft-passivation layer.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: October 3, 2000
    Assignees: Siemens Aktiengesellschaft, International Business Machines Corporation
    Inventors: Chandrasekhar Narayan, Bettina Dinkel
  • Energy relieving crack stop
    Patent number: 5834829
    Abstract: An energy relieving, redundant crack stop and the method of producing the same is disclosed. The redundant pattern allows the crack propagating energy that is not absorbed by the first ring of metallization to be absorbed by a second area of metallization and also provides a greater surface area over which the crack producing energy may be spread. The redundant crack stop is produced during the metallization process along with the rest of the wiring of the chip surface and, therefore, no additional production steps are necessary to form the structure.
    Type: Grant
    Filed: September 5, 1996
    Date of Patent: November 10, 1998
    Assignees: International Business Machines Corporation, Siemens Components, Inc.
    Inventors: Bettina A. Dinkel, Pei-Ing Lee, Ernest N. Levine