Abstract: The present invention relates to hot melt adhesive compositions comprising ethylene vinyl acetate copolymer(s) and isothiazolinone fungicides according to formula (I). Such hot melt adhesives show improved fungus resistance and are thus particularly suited for applications where such properties are desirable, such as ventilation and air-conditioning systems and air filters. The invention further relates to the use of said hot melt adhesives in such ventilation and air-conditioning systems and air filters as well as for bonding, stabilizing and sealing of pleats, edge and frame bonding, or seam sealing of bag filters. Further encompassed are air filters comprising the hot melt adhesives and methods of their manufacture using the hot melt adhesives of the invention.

Abstract: The present invention relates to hot melt adhesive compositions comprising ethylene vinyl acetate copolymer(s) and isothiazolinone fungicides according to formula (I). Such hot melt adhesives show improved fungus resistance and are thus particularly suited for applications where such properties are desirable, such as ventilation and air-conditioning systems and air filters. The invention further relates to the use of said hot melt adhesives in such ventilation and air-conditioning systems and air filters as well as for bonding, stabilizing and sealing of pleats, edge and frame bonding, or seam sealing of bag filters. Further encompassed are air filters comprising the hot melt adhesives and methods of their manufacture using the hot melt adhesives of the invention.

Abstract: The invention relates to the use of polyamides on the basis of reaction products from at least one dimeric fatty acid, at least one aliphatic dicarboxylic acid having 6 to 24 C atoms and aliphatic, cycloaliphatic and/or polyether diamines, wherein the quantities of amine components are selected so that primarily terminal amine groups are contained therein, and the polyamide comprises an amine count from 2 to 20 mg KOH/g to produce molded parts in the low pressure injection molding method.

Abstract: Polyamide hot-melt adhesives based on the reaction products of polymeric fatty acids, C14-C18 monocarboxylic acids, C6-C12 dicarboxylic acids and diamines which do not contain any water-extractable, environmentally toxic constituents, which are suitable for sealing cavities in soils, in rock formations, building structures and/or walls, in particular for sealing tunnels, galleries, shafts, channels or caverns, to protect against the penetration of water or the penetration of liquids or gases which contain hazardous substances.

Abstract: Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.

Abstract: Polyamide hot-melt adhesives based on the reaction products of polymeric fatty acids, C14-C18 monocarboxylic acids, C6-C12 dicarboxylic acids and diamines which do not contain any water-extractable, environmentally toxic constituents, which are suitable for sealing cavities in soils, in rock formations, building structures and/or walls, in particular for sealing tunnels, galleries, shafts, channels or caverns, to protect against the penetration of water or the penetration of liquids or gases which contain hazardous substances.

Abstract: Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.

Abstract: A composition of matter useful as a hotmelt adhesive is provided. The adhesive comprises a polyamide based on dimerized fatty acid, preferably having an amine value of less than 2, and at least one heat stabilizer for polyvinyl chloride, preferably selected from the group consisting of alkyl tin carboxylate compounds and epoxy compounds. The heat stabilizer is preferably present in an amount of 0.2% to 10.0% by weight of the composition. Also provided is a method of using the composition as a hotmelt adhesive for polyvinyl chloride.

Abstract: A plug-type connector for electrical coaxial cables includes a hot-melt-type adhesive for filling in the interior space between an outer bushing and centrally located contact bushing, with the contact bushing being configured for receiving an inner conductor of a coaxial cable. The hot-melt-type adhesive seals, fills, and insulates the interior portions of the plug-type connector surrounding the centrally located contact bushing and inner conductor of the associated coaxial cable. The hot-melt-type adhesive consists a polyamide based on dimerized fatty acids, aliphatic amines, and modifiers, and a copolyethylene and additives.