Patents by Inventor Bettina Schuster

Bettina Schuster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component Embedded in Component Carrier and Having an Exposed Side Wall
    Publication number: 20230135105
    Abstract: A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.
    Type: Application
    Filed: December 28, 2022
    Publication date: May 4, 2023
    Inventors: Bettina Schuster, Jonathan Silvano de Sousa, Andreas Zluc, Markus Leitgeb, Hannes Stahr
  • Component embedded in component carrier and having an exposed side wall
    Patent number: 11570897
    Abstract: A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: January 31, 2023
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Bettina Schuster, Jonathan Silvano de Sousa, Andreas Zluc, Markus Leitgeb, Hannes Stahr
  • Embedding component with pre-connected pillar in component carrier
    Patent number: 10765005
    Abstract: A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: September 1, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Hannes Stahr, Hannes Voraberger, Andreas Zluc, Bettina Schuster
  • Embedding Component With Pre-Connected Pillar in Component Carrier
    Publication number: 20190124772
    Abstract: A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.
    Type: Application
    Filed: October 24, 2018
    Publication date: April 25, 2019
    Inventors: Hannes Stahr, Hannes Voraberger, Andreas Zluc, Bettina Schuster
  • Component Embedded in Component Carrier and Having an Exposed Side Wall
    Publication number: 20190045636
    Abstract: A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 7, 2019
    Inventors: Bettina Schuster, Jonathan Silvano de Sousa, Andreas Zluc, Markus Leitgeb, Hannes Stahr