Patents by Inventor Betty O'Dowd

Betty O'Dowd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making electronic devices including silicon and LTCC and devices produced thereby
    Patent number: 6987033
    Abstract: A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: January 17, 2006
    Assignee: Harris Corporation
    Inventors: Randy T. Pike, Charles M. Newton, Carol Gamlen, Raymond C. Rumpf, Betty O'Dowd
  • Method for making electronic devices including silicon and LTCC and devices produced thereby
    Publication number: 20050019986
    Abstract: A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.
    Type: Application
    Filed: August 19, 2004
    Publication date: January 27, 2005
    Inventors: Randy Pike, Charles Newton, Carol Gamlen, Raymond Rumpf, Betty O'Dowd
  • Method for making electronic devices including silicon and LTCC and devices produced thereby
    Patent number: 6809424
    Abstract: A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: October 26, 2004
    Assignee: Harris Corporation
    Inventors: Randy T. Pike, Charles M. Newton, Carol Gamlen, Raymond C. Rumpf, Betty O'Dowd
  • Method for making electronic devices including silicon and LTCC and devices produced thereby
    Publication number: 20020130408
    Abstract: A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.
    Type: Application
    Filed: March 8, 2001
    Publication date: September 19, 2002
    Applicant: Harris Corporation
    Inventors: Randy T. Pike, Charles M. Newton, Carol Gamlen, Raymond C. Rumpf, Betty O'Dowd