Patents by Inventor Bevin Schmidt

Bevin Schmidt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8023271
    Abstract: Improved Sealed Expansion Module is an enclosure for housing electronics, such as circuit boards, POTS/VDSL cables having connectors, a fiber cable having a connector and a power cable having a connector. The preferred embodiment of Improved Sealed Expansion Module is comprised of at least some of the following: an enclosure having two internally undivided chambers (upper and lower), an access hatch attached with captive fasteners to the lower chamber of the enclosure, circuit boards located in the upper chamber of the enclosure, a surge protector and POTS/VDSL, fiber and power cables with connectors within the lower chamber of the enclosure, and a plurality of openings on the bottom of the lower chamber for POTS/VDSL interconnection cables, fiber interconnection cables, power interconnection cables at customer sites.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: September 20, 2011
    Assignee: Alcatel Lucent
    Inventors: Angelo Arlotta, Nicholas Adam Bundza, Stefano De Cecco, Peter Serjak, Bevin Schmidt
  • Publication number: 20090101382
    Abstract: Improved Sealed Expansion Module is an enclosure for housing electronics, such as circuit boards, POTS/VDSL cables having connectors, a fiber cable having a connector and a power cable having a connector. The preferred embodiment of Improved Sealed Expansion Module is comprised of at least some of the following: an enclosure having two internally undivided chambers (upper and lower), an access hatch attached with captive fasteners to the lower chamber of the enclosure, circuit boards located in the upper chamber of the enclosure, a surge protector and POTS/VDSL, fiber and power cables with connectors within the lower chamber of the enclosure, and a plurality of openings on the bottom of the lower chamber for POTS/VDSL interconnection cables, fiber interconnection cables, power interconnection cables at customer sites.
    Type: Application
    Filed: October 17, 2007
    Publication date: April 23, 2009
    Inventors: Angelo Arlotta, Nicholas Adam Bundza, Stefano De Cecco, Peter Serjak, Bevin Schmidt
  • Publication number: 20090097212
    Abstract: A high connector density printed circuit board, and high connector density device containing the same, including one or more of the following: a face plate; a plurality of connector ports in the face plate; a tab integral with the face plate label and bent to extend away from the face plate; information printed on the tab; the tab forming a plane at an angle of ninety degrees with respect to the face plate; the tab fabricated from a material having a combination of a thickness and a stiffness minimally able to resist a deformation resulting from a force of gravity; a second tab that is integral with the face plate and bent to extend away from the face plate; and the tabs do not infringe on an adjacent space occupied by another high connector density printed circuit board.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 16, 2009
    Inventors: Bevin Schmidt, Fabien Letourneau
  • Publication number: 20070264921
    Abstract: A ventilated housing for accommodating one or more components comprises opposed first and second-spaced apart end portions. An air barrier extends at least partially between the first and second end portions for limiting movement of air inside the housing and defining an upper or lower surface of the housing. A first part of the air barrier proximate the first end portion is positioned at a level below the level of a second part of the air barrier proximate the second end portion. An inlet is defined for admitting air into the housing and an outlet is defined for discharging air from the housing. An ventilated housing assembly comprises first and second housings with an angled space between a lower air barrier of the first housing and an upper air barrier of the second housing.
    Type: Application
    Filed: May 10, 2006
    Publication date: November 15, 2007
    Inventors: Fabien Letourneau, Bevin Schmidt, Nicholas Bundza
  • Patent number: 6370035
    Abstract: An electronic circuit pack having a printed circuit board with a faceplate at a front of the board. The faceplate has two end regions carrying latches for holding the board into a shelf. A front wall of the faceplate has an intermediate part between the end regions, the intermediate part extending forwardly of the end regions and lying at least between the latches. Preferably, the intermediate part of the front wall extends as far as a frontal vertical plane of the shelf which is the foremost position allowable for a shelf and a circuit board combination. The intermediate part of the front wall lying in this forward position provides additional space behind it for extending the electronic circuitry of the circuit pack for a unitary shelf size. This additional space is occupied by the printed circuit board with conductors and electronic components and/or connectors for test purposes and memory cards.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: April 9, 2002
    Assignee: Alcatel Canada Inc.
    Inventors: Stefano De Cecco, David Kiesekamp, Bevin Schmidt, Simon Davis
  • Patent number: D446850
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: August 21, 2001
    Assignee: Alcatel Canada, Inc.
    Inventors: Angelo Arlotta, David Kiesekamp, Bevin Schmidt
  • Patent number: D449032
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: October 9, 2001
    Assignee: Alcatel Canada Inc.
    Inventors: David Kiesekamp, Bevin Schmidt
  • Patent number: D449680
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: October 23, 2001
    Assignee: Alcatel Canada Inc.
    Inventors: Angelo Arlotta, David Kiesekamp, Bevin Schmidt
  • Patent number: D461235
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: August 6, 2002
    Assignee: Alcatel Canada Inc.
    Inventors: Angelo Arlotta, David Kiesekamp, Bevin Schmidt