Abstract: A corrosion resistant strip is disclosed. The strip comprises a core, and an interlayer adapted to be located between the core and an optional Al—Si based clad. The interlayer has a composition essentially consisting of (in percentages by weight): Si?0.9%, Fe?0.7%, Cu?0.5%, Mn 0.5-1.8%, Mg?0.7%, Zn?4.0%, Ni?1.5%, elements selected from group IVb, Vb, and/or VIb of the periodic table ?0.3% each and ?0.5% in total ?0.05 wt % each and ?0.15% in total, of unavoidable impurity elements, balance Al. The core is more noble than the interlayer after brazing. The interlayer exhibits a volume fraction of a texture component of at least 30%.

Abstract: A corrosion resistant strip is disclosed. The strip comprises a core, and an interlayer adapted to be located between the core and an optional Al—Si based clad. The interlayer has a composition essentially consisting of (in percentages by weight): Si?0.9%, Fe?0.7%, Cu?0.5%, Mn0.5-1.8%, Mg?0.7%, Zn?4.0%, Ni?1.5%, elements selected from group IVb, Vb, and/or VIb of the periodic table ?0.3% each and ?0.5% in total ?0.05 wt % each and ?0.15% in total, of unavoidable impurity elements, balance Al. The core is more noble than the interlayer after brazing. The interlayer exhibits a volume fraction of a texture component of at least 30%.

Abstract: The invention relates to an electrical conductor (2) having a longitudinal axis (A) parallel to the rolling direction of a conductor wire, comprising copper material and an attachment surface (7) configured for attaching to a receiving surface of a silicon wafer (3) to establish an electrical connection. The copper material has a purity of at least 99.5% wherein the grains have a cubic texture comprising a set of cubic axes directed within an up to 20 degree angular range to the longitudinal axis (A), and whereby at least 65% of the grains have said cubic texture. The invention also relates to a process for manufacturing conductor (2) and photo voltaic modules comprising said conductor (2), and silicon wafers.