Patents by Inventor Beytullah Yasin KILIC

Beytullah Yasin KILIC has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11944830
    Abstract: One aspect is a feedthrough system including a) a feedthrough including i) an insulating body, ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body, iii) an electrically conductive pad, wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway, b) an electrical contact element including a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, or wherein, when the feedthrough includes an electrically conductive pad, the electrical contact element is attached to the electrically conductive pad by a joint microstructure. Furthermore, the present embodiment refers to a process for preparing the inventive feedthrough system, and to a device including the inventive feedthrough system.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: April 2, 2024
    Assignees: Heraeus Deutschland GmbH & Co. KG, Heraeus Additive Manufacturing GmbH
    Inventors: Beytullah Yasin Kilic, Leoni Wilhelm, Jakob Fischer, Jens Trötzschel
  • Publication number: 20210330984
    Abstract: One aspect is a feedthrough system including a) a feedthrough including i) an insulating body, ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body, iii) an electrically conductive pad, wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway, b) an electrical contact element including a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, or wherein, when the feedthrough includes an electrically conductive pad, the electrical contact element is attached to the electrically conductive pad by a joint microstructure. Furthermore, the present embodiment refers to a process for preparing the inventive feedthrough system, and to a device including the inventive feedthrough system.
    Type: Application
    Filed: April 26, 2021
    Publication date: October 28, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Beytullah Yasin KILIC, Leoni WILHELM, Jakob FISCHER, Jens TRÖTZSCHEL