Patents by Inventor Bhagubhai D. Patel

Bhagubhai D. Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
    Patent number: 5000827
    Abstract: A method and apparatus for electroplating metallized bumps of substantially uniform height on predetermined terminal areas of a substrate. Cup plating apparatus includes elements for adjusting parameters affecting the geometry of the substrate relative to the plating cup, as well as flow rate of the electroplating solution against the substrate surface. By achieving non-laminar flow of the electroplating solution near the substrate edges, the plating characteristics of the electroplating solution are altered in this region, substantialy offsetting "edge effect", so that the resulting plated bump height is substantially uniform across the substrate.
    Type: Grant
    Filed: January 2, 1990
    Date of Patent: March 19, 1991
    Assignee: Motorola, Inc.
    Inventors: Virgil E. Schuster, Reginald K. Asher, Sr., Bhagubhai D. Patel