Abstract: A sensor assembly for a liftgate opening system for a rear liftgate of a motor vehicle is provided. The rear liftgate includes a door frame, a stationary window, a lock device, and an actuator for moving the lock device between locked and unlocked states. The sensor assembly includes a housing attached to the stationary window and a substrate disposed within the housing. The sensor assembly further includes a capacitive touch sensor engaging a target portion of the stationary window and configured to generate a touch signal, in response to a user touching the target portion of the stationary window. The sensor assembly further includes a proximity sensor generating a proximity signal, in response to the user being disposed within a predetermined distance of the proximity sensor.

Abstract: A flexible circuit board includes a flexible substrate having a first portion, a second portion, and a first side defining part of the first portion and the second portion. Electrical components are disposed on the first side in the first portion and in the second portion. The flexible substrate is folded between the first portion and the second portion such that the first portion overlays the second portion and the first side is directed outwards.

Abstract: An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a first face, a flexible printed circuit connected to the first face of the printed circuit board, a filler component arranged over a first portion of the first face of the printed circuit board, a housing defining a cavity, wherein the filler component is arranged in the cavity, a channel guide extending from the housing, wherein the flexible printed circuit sits in the channel guide, and a substrate positioned adjacent to a second face of the printed circuit board, wherein the second face opposes the first face.

Abstract: A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the light emitting diode and fills the through aperture and covers substantially all of the first face positioned outside of the space envelope containing the connector.

Abstract: An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a first face, a flexible printed circuit connected to the first face of the printed circuit board, a filler component arranged over a first portion of the first face of the printed circuit board, a housing defining a cavity, wherein the filler component is arranged in the cavity, a channel guide extending from the housing, wherein the flexible printed circuit sits in the channel guide, and a substrate positioned adjacent to a second face of the printed circuit board, wherein the second face opposes the first face.

Abstract: A molded component assembly includes a printed circuit board with a first face and a second face, and multiple through apertures. Multiple light emitting diodes are mounted on a first portion of the first face. A light guide of a light translucent polymeric material is positioned proximate to the light emitting diodes. The light guide includes: a contact surface directly contacting the first portion of the first face; multiple light outlets, each aligned to receive visible light emitted from one of the light emitting diodes; and multiple integrally formed light reflectors. Each light reflector extends into one of the light outlets and over one of the through apertures, and each includes a first reflector surface, a second reflector surface and a third reflector surface each oriented non-orthogonal to the contact surface to reflect light from one of the light emitting diodes into one of the light outlets.

Abstract: A component assembly includes a printed circuit board having an electronics component mounted on a first portion of a first face of the printed circuit board. A light emitting diode is mounted on a second portion of the first face. A light guide of a light transmissive polymeric material covers the body including the light emitting diode and the electronics component. The light guide includes: a cavity having the electronics component positioned within the cavity; a non-planar area of the light guide positioned above the cavity, the non-planar area mitigating against collapse of the light guide into the cavity; and a second cavity having the light emitting diode positioned within the second cavity; and a top plate of a polymeric light reflective material mounted onto the light guide directly above the light emitting diode.

Abstract: A flexible circuit board includes a flexible substrate having a first portion, a second portion, and a first side defining part of the first portion and the second portion. Electrical components are disposed on the first side in the first portion and in the second portion. The flexible substrate is folded between the first portion and the second portion such that the first portion overlays the second portion and the first side is directed outwards.

Abstract: A component assembly includes a printed circuit board having an electronics component mounted on a first portion of a first face of the printed circuit board. A light emitting diode is mounted on a second portion of the first face. A light guide of a light transmissive polymeric material covers the body including the light emitting diode and the electronics component. The light guide includes: a cavity having the electronics component positioned within the cavity; a non-planar area of the light guide positioned above the cavity, the non-planar area mitigating against collapse of the light guide into the cavity; and a second cavity having the light emitting diode positioned within the second cavity; and a top plate of a polymeric light reflective material mounted onto the light guide directly above the light emitting diode.

Abstract: A molded component assembly includes a printed circuit board with a first face and an oppositely facing second face. Multiple light emitting diodes are mounted on a first portion of the first face. Multiple electronics components are mounted on a second portion of the first face. A light guide of a light translucent polymeric material has a contact surface directly contacting the first portion of the first face and multiple light outlets defining cavities in the light guide. The light guide is seated over the light emitting diodes and directly receives visible light from the light emitting diodes and transmits the visible light to the light outlets. A reflector plate directly contacts the light guide and extends over the second portion including the electronics components, and includes filler members extending into the light guide. The reflector plate reflects visible light back into the light guide.

Abstract: A molded component assembly includes a printed circuit board with a first face and a second face, and multiple through apertures. Multiple light emitting diodes are mounted on a first portion of the first face. A light guide of a light translucent polymeric material is positioned proximate to the light emitting diodes. The light guide includes: a contact surface directly contacting the first portion of the first face; multiple light outlets, each aligned to receive visible light emitted from one of the light emitting diodes; and multiple integrally formed light reflectors. Each light reflector extends into one of the light outlets and over one of the through apertures, and each includes a first reflector surface, a second reflector surface and a third reflector surface each oriented non-orthogonal to the contact surface to reflect light from one of the light emitting diodes into one of the light outlets.

Abstract: A laminated light guide and component carrier includes a light guide of a light transmissive polymeric material. The light guide has a pocket in a first face. First electrical traces are printed on the first face. A light emitting diode is positioned in the pocket and supported on the light guide by attachment legs which extend outward from the pocket electrically connecting the light emitting diode to the first electrical traces. A light reflector is formed as a texturally modified area of the light guide directly aligned with the light emitting diode. A capacitive touch sensor is printed on a light guide second face and connected to second electrical traces defining capacitive touch traces printed on the second face. A window region of the light guide is defined where the capacitive touch sensor is aligned with the light reflector and the light emitting diode.

Abstract: A component assembly includes a body having an electronics component mounted on a first face of the body. A light emitting diode is mounted on a first portion of the first face. A top plate is attached to the body and covers the light emitting diode and the electronics component. The top plate includes: a first cavity having the electronics component positioned within the first cavity; and a first support area homogeneously connected to the top plate and extending from the top plate to directly contact the body outside of the cavity to provide support for the top plate and to mitigate against collapse of the cavity.

Abstract: A molded component assembly includes a printed circuit board with a first face and an oppositely facing second face. Multiple light emitting diodes are mounted on a first portion of the first face. Multiple electronics components are mounted on a second portion of the first face. A light guide of a light translucent polymeric material is positioned over the light emitting diodes and the electronic components. The light guide includes: a contact surface directly contacting the first portion of the first face except at locations of the light emitting diodes; a cavity created in the contact surface, the electronics components located within the cavity when the contact surface directly contacts the first portion of the first face; and a through hole extending through a body of the light guide and opening into the cavity.

Abstract: A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the first face proximate to and covering the light emitting diode and filling the through aperture, and omitted from the space envelope containing the connector. An opaque polymeric material coating layer is affixed onto the first face outside of the light guide.

Abstract: A molded component assembly includes a printed circuit board with a first face and an oppositely facing second face. Multiple light emitting diodes are mounted on a first portion of the first face. Multiple electronics components are mounted on a second portion of the first face. A light guide of a light translucent polymeric material has a contact surface, multiple light outlets, and multiple light emitting diode receiving pockets defining recesses in the contact surface, each sized to receive one of the light emitting diodes when the contact surface directly contacts the first portion of the first face, with visible light from the light emitting diodes transmitted through the light guide to the light outlets. A first polymeric material is molded over a portion of the second portion of the first face encapsulating the electronics components and contacting a portion of the light guide.

Abstract: A laminated printed circuit board with over-molded light guide includes a printed circuit board having electronic components mounted on a first face of the printed circuit board, and a bore extending through the printed circuit board. A light emitting diode is mounted on the first face proximate to the bore. An opaque film is fixed onto a second face of the printed circuit board, the opaque film creating an end wall of the bore. A light transmissive polymeric material is applied over each of the electronic components, the light emitting diode and a portion of the first face of the printed circuit board. A portion of the polymeric material extends into the bore and contacts the opaque film defining the end wall of the bore to create a light guide for transmitting light from the light emitting diode through the bore.

Abstract: A molded component assembly includes a printed circuit board with a first face and an oppositely facing second face. Multiple light emitting diodes are mounted on a first portion of the first face. Multiple electronics components are mounted on a second portion of the first face. A light guide of a light translucent polymeric material has a contact surface directly contacting the first portion of the first face and multiple light outlets defining cavities in the light guide. The light guide is seated over the light emitting diodes and directly receives visible light from the light emitting diodes and transmits the visible light to the light outlets. A reflector plate directly contacts the light guide and extends over the second portion including the electronics components, and includes filler members extending into the light guide. The reflector plate reflects visible light back into the light guide.

Abstract: A molded component assembly includes a printed circuit board with a first face and an oppositely facing second face. Multiple light emitting diodes are mounted on a first portion of the first face. Multiple electronics components are mounted on a second portion of the first face. A light guide of a light translucent polymeric material is positioned over the light emitting diodes and the electronic components. The light guide includes: a contact surface directly contacting the first portion of the first face except at locations of the light emitting diodes; a cavity created in the contact surface, the electronics components located within the cavity when the contact surface directly contacts the first portion of the first face; and a through hole extending through a body of the light guide and opening into the cavity.

Abstract: A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the first face proximate to and covering the light emitting diode and filling the through aperture, and omitted from the space envelope containing the connector. An opaque polymeric material coating layer is affixed onto the first face outside of the light guide.