Abstract: The present disclosure relates to field of an arrangement of multiple optical elements to generate multiple beam patterns. The arrangement (100) of multiple optical elements to plurality of fasteners (112), and an optics plate (106). The array board (102) having LEDs (104) mounted thereon in a plurality of first blade patterns (124a-124d). The optics plate (106) is removably fastened to the array board. The optics plate (106) defines lenses (108) in a plurality of second blade patterns (126a-126d) and reflectors (110) in a plurality of third blade patterns (128a-128d), identical to the first blade pattern (124a-124d). The optics plate (106) is manually rotated into a first configuration to align the second blade pattern (126a-126d) with the first blade pattern (124a-124d) and into a second configuration to align the third blade pattern (128a-128d) with the first blade pattern (124a-124d) to generate multiple beam patterns.

Abstract: The present disclosure relates to field of an arrangement of multiple optical elements to generate multiple beam patterns. The arrangement (100) of multiple optical elements to plurality of fasteners (112), and an optics plate (106). The array board (102) having LEDs (104) mounted thereon in a plurality of first blade patterns (124a-124d). The optics plate (106) is removably fastened to the array board. The optics plate (106) defines lenses (108) in a plurality of second blade patterns (126a-126d) and reflectors (110) in a plurality of third blade patterns (128a-128d), identical to the first blade pattern (124a-124d). The optics plate (106) is manually rotated into a first configuration to align the second blade pattern (126a-126d) with the first blade pattern (124a-124d) and into a second configuration to align the third blade pattern (128a-128d) with the first blade pattern (124a-124d) to generate multiple beam patterns.

Abstract: An encapsulated LED engine including a printed circuit board, a plurality of LED arrays, each of the LED arrays mounted on the printed circuit board, and electrically connected to each other wherein, in each of the LED arrays, LEDs are electrically connected to each other; and an encapsulation layer configured to encapsulate each of the LED arrays and the electrical connections therebetween, wherein the encapsulation layer includes at least one blister configured to encapsulate at least one LED, and is further configured to transform the light emitted by said LED into a desired light beam pattern; and at least one planar portion configured to encapsulate at least one electrical connection formed on the printed circuit board.