Abstract: A system includes a feed preparation system, with a fluid injection system configured to inject a fluid into a feed stream to generate a feed-fluid mixture. The feed stream includes a first solid, a second solid, and a gas. The feed preparation system also includes a cyclone configured to separate the feed-fluid mixture into a first stream that includes the first solid and the gas, and a second stream that includes the second solid and the fluid.

Abstract: A coal separation unit for a gasification system includes a vessel having a top portion and a bottom portion, a first inlet configured to receive a feed stream including at least coal and ash from a grinding unit, a second inlet configured to receive a wash fluid stream, a first outlet configured to convey a low-ash feed stream, and a second outlet configured to convey an ash-rich stream. In operation, the feed stream is washed with the wash fluid stream in the separation unit to separate at least a portion of the ash from the coal. The separated ash settles to the bottom portion of the vessel and is conveyed via the second outlet as the ash-rich stream. The separated coal floats to the top portion of the vessel and is conveyed via the first outlet to a gasification unit as the low-ash feed stream.

Abstract: Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

Abstract: Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

Abstract: Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

Abstract: Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

Abstract: A network architecture for small, low-cost, high functionality portable wireless devices which shifts many of the functions performed in typical handheld communication devices to a central Application Server (AS) computer. Communication between the AS and the portable devices is performed using standard Internet Protocol (IP) devices. The AS includes a Client Proxy Server (CPS) which interfaces of applications on the server, and Device Personality Objects (DPOs) that handle the special characteristics of each different types of portable devices. Each portable device has a unique CPS/DPO pair running on the AS that accepts input from the portable devices and provides input to the various applications on the AS and which accepts outputs from the various applications and passes it to the portable devices. Communication from the portable devices to the AS is entirely via IP packets.

Abstract: Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

Abstract: A network architecture for small, low-cost, high functionality portable wireless devices which shifts many of the functions performed in typical handheld communication devices to a central Application Server (AS) computer. Communication between the AS and the portable devices is performed using standard Internet Protocol (IP) packets. The AS includes a Client Proxy Server (CPS) which interfaces to applications on the server, and Device Personality Objects (DPOs) that handle the special characteristics of each different types of portable devices. Each portable device has a unique CPS/DPO pair running on the AS that accepts input from the portable devices and provides input to the various applications on the AS and which accepts outputs from the various applications and passes it to the portable devices. Communication from the portable devices to the AS is entirely via IP packets.

Abstract: A network architecture for small, low-cost, high functionality portable wireless devices which shifts many of the functions performed in typical handheld communication devices to a central Application Server (AS) computer. Communication between the AS and the portable devices is performed using standard Internet Protocol (IP) packets. The AS includes a Client Proxy Server (CPS) which interfaces to applications on the server, and Device Personality Objects (DPOs) that handle the special characteristics of each different types of portable devices. Each portable device has a unique CPS/DPO pair running on the AS that accepts input from the portable devices and provides input to the various applications on the AS and which accepts outputs from the various applications and passes it to the portable devices. Communication from the portable devices to the AS is entirely via IP packets.

Abstract: A system and method are provided that allow users of a digital collaboration service to share information in such a way that an accurate record of the information shared during the digital collaboration is captured. Furthermore, the context in which the information is being exchanged amongst users of the service can also be captured. As a result, a system in accordance to one or more embodiments of the present invention is ideally suited for digital collaboration conducted amongst potential business partners, where maintaining an accurate record of what information was shared by each party is paramount. Furthermore, the capture of contextual information makes a system in accordance to one or more embodiments of the present invention ideally suited for digital collaboration conducted amongst users that are within the same company. For example, a development team may use a digital collaboration system in accordance to the present invention to conduct meetings.

Abstract: The present invention provides a monolithic or discrete high speed/low speed interface that is capable of interfacing with the high speed subsystems of a data processing system and low speed subsystems of a data processing system. In one embodiment, the high speed/low speed interface subsystem of the present invention comprises a high speed interface for interfacing with high speed subsystems via a high speed bus, a low speed interface for interfacing with low speed subsystems via a low speed bus, a control circuitry coupled to both the high speed and low speed interfaces, and an internal bus coupled to the control circuitry and the high speed and low speed interfaces. The control circuitry controls the transfer of information between the interfaces. In a second embodiment of the present invention, the high speed/low speed interface subsystem of the present invention comprises all the elements of the first embodiment and a prediction unit.