Patents by Inventor Bharath Nagabhushanam

Bharath Nagabhushanam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies
    Patent number: 6784367
    Abstract: Microelectronic devices having a protected input and methods for manufacturing such microelectronic devices. A microelectronic device has a microelectronic die and a support structure for coupling the die to voltage and signal sources. The microelectronic die can have integrated circuitry and a plurality of bond-pads coupled to the integrated circuitry. The bond-pads, for example, can include a reference voltage (Vref) bond-pad and a signal bond-pad adjacent to the Vref bond-pad. The signal bond-pad can be for a clock signal, a data signal, a strobe signal, an address signal, or another type signal for operating the integrated circuitry. The support structure can be a lead frame or a interposing substrate having a plurality of conductive members coupled to the bond-pads of the die. The conductive members can accordingly be metal pins in the case of lead frames or traces and solder ball-pads in the case of interposing substrates.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: August 31, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Ernest J. Russell, Bharath Nagabhushanam, Terry Lee, Roger Norwood
  • Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies
    Publication number: 20030127241
    Abstract: Microelectronic devices having a protected input and methods for manufacturing such microelectronic devices. A microelectronic device has a microelectronic die and a support structure for coupling the die to voltage and signal sources. The microelectronic die can have integrated circuitry and a plurality of bond-pads coupled to the integrated circuitry. The bond-pads, for example, can include a reference voltage (Vref) bond-pad and a signal bond-pad adjacent to the Vref bond-pad. The signal bond-pad can be for a clock signal, a data signal, a strobe signal, an address signal, or another type signal for operating the integrated circuitry. The support structure can be a lead frame or a interposing substrate having a plurality of conductive members coupled to the bond-pads of the die. The conductive members can accordingly be metal pins in the case of lead frames or traces and solder ball-pads in the case of interposing substrates.
    Type: Application
    Filed: February 25, 2003
    Publication date: July 10, 2003
    Inventors: Ernest J. Russell, Bharath Nagabhushanam, Terry Lee, Roger Norwood
  • Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies
    Patent number: 6548757
    Abstract: Microelectronic devices having a protected input and methods for manufacturing such microelectronic devices. A microelectronic device has a microelectronic die and a support structure for coupling the die to voltage and signal sources. The microelectronic die can have integrated circuitry and a plurality of bond-pads coupled to the integrated circuitry. The bond-pads, for example, can include a reference voltage (Vref) bond-pad and a signal bond-pad adjacent to the Vref bond-pad. The signal bond-pad can be for a clock signal, a data signal, a strobe signal, an address signal, or another type signal for operating the integrated circuitry. The support structure can be a lead frame or a interposing substrate having a plurality of conductive members coupled to the bond-pads of the die. The conductive members can accordingly be metal pins in the case of lead frames or traces and solder ball-pads in the case of interposing substrates.
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: April 15, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Ernest J. Russell, Bharath Nagabhushanam, Terry Lee, Roger Norwood