Patents by Inventor Bharath Ramakrishnan
Bharath Ramakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240147663Abstract: A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.Type: ApplicationFiled: January 11, 2024Publication date: May 2, 2024Applicant: Microsoft Technology Licensing, LLCInventors: Husam Atallah ALISSA, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Eric C. PETERSON, Bharath RAMAKRISHNAN, Christian L. BELADY, Ricardo Gouvea BIANCHINI
-
Publication number: 20240138112Abstract: A thermal management system for cooling electronics includes an immersion tank, a working fluid in the immersion tank, a heat exchanger, a first fluid conduit, and a second fluid conduit. The heat exchanger is configured to transfer thermal energy from the working fluid to ambient air to cool the working fluid. The first fluid conduit provides fluid communication from the immersion tank to the heat exchanger, and the second fluid conduit provides fluid communication from the heat exchanger to a spray nozzle to spray working fluid into the immersion tank.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Inventors: Eric C. PETERSON, Husam Atallah ALISSA, Bharath RAMAKRISHNAN
-
Patent number: 11956930Abstract: A liquid-submersible thermal management system includes a shell, a heat-generating component, a working fluid, and at least one heat-dispersing element. The shell defines an immersion chamber where the heat-generating component is located in the immersion chamber. The working fluid is positioned in the immersion chamber and at least partially surrounds the heat-generating component so the working fluid receives heat from the heat-generating component. The at least one heat-dispersing element is positioned on exterior surface of the shell to conduct heat from the shell into the heat-dispersing element.Type: GrantFiled: December 19, 2022Date of Patent: April 9, 2024Assignee: Microsoft Technology Licensing, LLCInventors: Husam Atallah Alissa, Ioannis Manousakis, Nicholas Andrew Keehn, Eric C. Peterson, Bharath Ramakrishnan, Christian L. Belady, Ricardo Gouvea Bianchini
-
Publication number: 20240107716Abstract: A thermal management system includes a high-pressure (HP) container, a low-pressure (LP) container in fluid communication with the HP container and having a fluid pressure less than the HP container, and a two-phase working fluid partially in the HP container and partially in the LP container. The two-phase working fluid has a vapor phase and a liquid phase. A pump is configured to move the working fluid through the system, and a condenser is configured to condense the vapor phase of the working fluid into the liquid phase.Type: ApplicationFiled: September 27, 2022Publication date: March 28, 2024Inventors: Ehsan NASR AZADANI, Bharath RAMAKRISHNAN, Nicholas Andrew KEEHN, Husam Atallah ALISSA, Ruslan NAGIMOV, Eric C. PETERSON
-
Patent number: 11909449Abstract: An electronic device includes a substrate having a first surface and an opposite second surface; a photonic transmitter supported by the first surface of the substrate; a photonic receiver supported by the first surface of the substrate; a microfluidic volume positioned in the second surface of the substrate; a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume; and a working fluid in the microfluidic volume to receive heat from the waveguide.Type: GrantFiled: May 31, 2023Date of Patent: February 20, 2024Assignee: Microsoft Technology Licensing, LLCInventors: Vaidehi Oruganti, Bharath Ramakrishnan, Husam Atallah Alissa, Christian L. Belady
-
Patent number: 11910567Abstract: A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.Type: GrantFiled: March 13, 2023Date of Patent: February 20, 2024Assignee: Microsoft Technology Licensing, LLCInventors: Husam Atallah Alissa, Ioannis Manousakis, Nicholas Andrew Keehn, Eric C. Peterson, Bharath Ramakrishnan, Christian L. Belady, Ricardo Gouvea Bianchini
-
Patent number: 11903166Abstract: A thermal management system for cooling electronics includes an immersion tank, a working fluid in the immersion tank, a heat exchanger, a first fluid conduit, and a second fluid conduit. The heat exchanger is configured to transfer thermal energy from the working fluid to ambient air to cool the working fluid. The first fluid conduit provides fluid communication from the immersion tank to the heat exchanger, and the second fluid conduit provides fluid communication from the heat exchanger to a spray nozzle to spray working fluid into the immersion tank.Type: GrantFiled: May 28, 2021Date of Patent: February 13, 2024Assignee: Microsoft Technology Licensing, LLCInventors: Eric C. Peterson, Husam Atallah Alissa, Bharath Ramakrishnan
-
Publication number: 20240009614Abstract: A carbon capture system includes two carbon capture plates. A first carbon capture plate collects carbon dioxide from a flow of ambient air. A second carbon capture plate releases carbon dioxide upon application of heat from a heat exchanger. The heat is exhaust heat from a data center. The first carbon capture plate and the second carbon capture plate are rotatable between the capture and release positions. The carbon capture system uses the waste heat from a data center to collect and store atmospheric carbon dioxide, thereby reducing the concentration of atmospheric carbon dioxide.Type: ApplicationFiled: September 22, 2023Publication date: January 11, 2024Inventors: Husam Atallah ALISSA, Mark Alan MONROE, Bharath RAMAKRISHNAN, Vaidehi ORUGANTI
-
Publication number: 20230422435Abstract: A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.Type: ApplicationFiled: June 24, 2022Publication date: December 28, 2023Inventors: Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Christian L. BELADY, Sean Michael JAMES, Vaidehi ORUGANTI
-
Publication number: 20230403830Abstract: A thermal management system for cooling electronic devices includes an immersion cooling system, a vapor buffer tank, and a liquid buffer tank. The immersion cooling system includes an immersion tank defining an immersion chamber, a working fluid in the immersion chamber, and a condenser. A liquid portion of the working fluid defines an immersion bath in the immersion chamber and a vapor portion defines a headspace above the immersion bath in the immersion chamber. The condenser condenses the vapor portion of the working fluid to the liquid portion of the working fluid. The vapor buffer tank is in fluid communication with the headspace, and a vapor valve selectively allows fluid communication between the vapor buffer tank and the headspace. The liquid buffer tank is in fluid communication with the immersion chamber, and a liquid valve selectively allows fluid communication between the liquid buffer tank and the immersion chamber.Type: ApplicationFiled: August 25, 2023Publication date: December 14, 2023Inventors: Husam Atallah ALISSA, Stephan Wayne GILGES, Eric C. PETERSON, Sean Michael JAMES, Christian L. BELADY, Marcus Felipe FONTOURA, Ioannis MANOUSAKIS, Bharath RAMAKRISHNAN
-
Publication number: 20230403821Abstract: Techniques for dynamically changing a pressure within a pressurized cooling system to thereby allow different cooling rates to be used to cool electronic equipment are disclosed. A pressurized cooling system cools electronic heat generating components using dielectric heat transfer fluid disposed within a two-phase immersion cooling container. This container is operable to maintain different pressure levels. The pressurized cooling system includes a pressure system structured to modify a pressure within the container. The system operates in a first state when the pressure is above a threshold pressure. The system operates in a second state when the pressure is at the threshold pressure. The system operates in either one of the first state or the second state based on an operating state of the heat generating component.Type: ApplicationFiled: June 14, 2022Publication date: December 14, 2023Inventors: Vaidehi ORUGANTI, Christian L. BELADY, Husam ALISSA, Bharath RAMAKRISHNAN, Ruslan NAGIMOV
-
Patent number: 11801470Abstract: A carbon capture system includes two carbon capture plates. A first carbon capture plate collects carbon dioxide from a flow of ambient air. A second carbon capture plate releases carbon dioxide upon application of heat from a heat exchanger. The heat is exhaust heat from a data center. The first carbon capture plate and the second carbon capture plate are rotatable between the capture and release positions. The carbon capture system uses the waste heat from a data center to collect and store atmospheric carbon dioxide, thereby reducing the concentration of atmospheric carbon dioxide.Type: GrantFiled: December 29, 2021Date of Patent: October 31, 2023Assignee: Microsoft Technology Licensing, LLCInventors: Husam Atallah Alissa, Mark Alan Monroe, Bharath Ramakrishnan, Vaidehi Oruganti
-
Publication number: 20230345673Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.Type: ApplicationFiled: April 20, 2022Publication date: October 26, 2023Inventors: Dennis TRIEU, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Husam Atallah ALISSA, Bharath RAMAKRISHNAN, Kathryn M. OSEEN-SENDA, Douglas Patrick KELLEY, Alexis Grace SCHUBERT
-
Publication number: 20230341910Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.Type: ApplicationFiled: April 20, 2022Publication date: October 26, 2023Inventors: Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Eric C. PETERSON, Christian L. BELADY, Dennis TRIEU, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Kathryn M. OSEEN-SENDA, Douglas Patrick KELLEY
-
Publication number: 20230338948Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature positioned on a pin surface of the pin fin.Type: ApplicationFiled: April 20, 2022Publication date: October 26, 2023Inventors: Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Eric C. PETERSON, Christian L. BELADY, Dennis TRIEU
-
Publication number: 20230337396Abstract: An immersion cooling system includes an immersion tank that is configured to retain dielectric working fluid and to hold a plurality of computing devices submerged in the dielectric working fluid. The immersion cooling system also includes a condenser that is configured to cause condensation of vaporized working fluid. The immersion cooling system also includes a subcooling heat exchanger that is in fluid communication with a coolant source. The coolant source provides coolant having a coolant temperature that is lower than a boiling point of the dielectric working fluid. The subcooling heat exchanger is positioned so that heat transfer can occur between the dielectric working fluid and the subcooling heat exchanger. The immersion cooling system also includes a control system that controls how much of the coolant flows into the subcooling heat exchanger based at least in part on a temperature of the dielectric working fluid.Type: ApplicationFiled: June 22, 2023Publication date: October 19, 2023Inventors: Husam Atallah ALISSA, Bharath RAMAKRISHNAN, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Eric Clarence PETERSON
-
Patent number: 11792962Abstract: A thermal management system for cooling electronic devices includes an immersion cooling system, a vapor buffer tank, and a liquid buffer tank. The immersion cooling system includes an immersion tank defining an immersion chamber, a working fluid in the immersion chamber, and a condenser. A liquid portion of the working fluid defines an immersion bath in the immersion chamber and a vapor portion defines a headspace above the immersion bath in the immersion chamber. The condenser condenses the vapor portion of the working fluid to the liquid portion of the working fluid. The vapor buffer tank is in fluid communication with the headspace, and a vapor valve selectively allows fluid communication between the vapor buffer tank and the headspace. The liquid buffer tank is in fluid communication with the immersion chamber, and a liquid valve selectively allows fluid communication between the liquid buffer tank and the immersion chamber.Type: GrantFiled: May 5, 2021Date of Patent: October 17, 2023Assignee: Microsoft Technology Licensing, LLCInventors: Husam Atallah Alissa, Stephan Wayne Gilges, Eric C. Peterson, Sean Michael James, Christian L. Belady, Marcus Felipe Fontoura, Ioannis Manousakis, Bharath Ramakrishnan
-
Patent number: 11729948Abstract: An immersion cooling system includes an immersion tank that is configured to retain dielectric working fluid and to hold a plurality of computing devices submerged in the dielectric working fluid. The immersion cooling system also includes a condenser that is configured to cause condensation of vaporized working fluid. The immersion cooling system also includes a subcooling heat exchanger that is in fluid communication with a coolant source. The coolant source provides coolant having a coolant temperature that is lower than a boiling point of the dielectric working fluid. The subcooling heat exchanger is positioned so that heat transfer can occur between the dielectric working fluid and the subcooling heat exchanger. The immersion cooling system also includes a control system that controls how much of the coolant flows into the subcooling heat exchanger based at least in part on a temperature of the dielectric working fluid.Type: GrantFiled: May 13, 2021Date of Patent: August 15, 2023Assignee: Microsoft Technology Licensing, LLCInventors: Husam Atallah Alissa, Bharath Ramakrishnan, Ioannis Manousakis, Nicholas Andrew Keehn, Eric Clarence Peterson
-
Publication number: 20230225079Abstract: A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.Type: ApplicationFiled: March 13, 2023Publication date: July 13, 2023Inventors: Husam Atallah ALISSA, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Eric C. PETERSON, Bharath RAMAKRISHNAN, Christian L. BELADY, Ricardo Gouvea BIANCHINI
-
Publication number: 20230217626Abstract: Fluid replacement structures used in immersion cooling tanks can include various enhancements to make them functional beyond simply taking up space. For example, the density of fluid replacement structures can be variable to assist with buoyancy control. As another example, fluid replacement structures can be designed to enable vaporized working fluid to be directed to a desired location. As another example, fluid replacement structures can include emergency cooling features, such as different substances that cause an endothermic reaction to occur when they are mixed together. The substances can be separated by a membrane that melts when the temperature reaches a certain point. As another example, a fluid replacement structure can provide structural support for an immersion cooling tank when negative pressure operations are performed. Fluid replacement structures can also include alignment features, lifting features, locking features, mating guides, fiducial markers, or the like.Type: ApplicationFiled: December 30, 2021Publication date: July 6, 2023Inventors: Nicholas Andrew KEEHN, Husam Atallah ALISSA, Bharath RAMAKRISHNAN, Martha Geoghegan PETERSON, Eric Clarence PETERSON