Abstract: The present disclosure is directed to package-on-package structures having a package substrate with an embedded logic package disposed on the package substrate and having heat conductive pathways being provided in the package-on-package structure for removing heat from the logic package. In an aspect, the heat conductive pathways enable a downward transfer of the heat generated by the logic package toward the package substrate. In another aspect, the heat conducting pathways may include a heat transfer layer formed proximally to a bottom surface of the logic package. In a further aspect, the heat conducting pathways may include one or more metal vias in the package substrate.

Abstract: Disclosed herein is a device that provides for high power transfer. The device may include a printed circuit board and a package substrate disposed on the printed circuit board. The device may also include a plurality of high-power voltage regulators disposed on and electrically connected to the package substrate. The device may also include a plurality of low-power voltage regulators disposed on and electrically connected to the printed circuit board.