Patents by Inventor Bhret Graydon
Bhret Graydon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9320135Abstract: Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.Type: GrantFiled: February 25, 2011Date of Patent: April 19, 2016Assignee: LITTELFUSE, INC.Inventors: Lex Kosowsky, Robert Fleming, Bhret Graydon, Daniel Vasquez
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Patent number: 9224728Abstract: Various disclosed aspects provide for protecting components (e.g., integrated circuits) from spurious electrical overvoltage events, such as electrostatic discharge. Embedded components with voltage switchable dielectric materials may protect circuits against electrostatic discharge.Type: GrantFiled: April 28, 2011Date of Patent: December 29, 2015Assignee: LITTELFUSE, INC.Inventors: Lex Kosowsky, Robert Fleming, Bhret Graydon, Daniel Vasquez
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Patent number: 9084354Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.Type: GrantFiled: August 28, 2012Date of Patent: July 14, 2015Assignee: LITTELFUSE, INC.Inventors: Robert Fleming, Lex Kosowsky, Shurui Shang, Bhret Graydon, Xiaofeng Chen, Glen Irvin
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Patent number: 9082622Abstract: Ferroic circuit elements that include a set of conductive structures that are at least partially embedded within a ferroic medium are disclosed. The ferroic medium may be a voltage switched dielectric material that includes ferroic particles in accordance with various embodiments. A ferroic circuit element may be at least partially embedded within a substrate in accordance with embodiments of the current invention as an embedded ferroic circuit element. An embedded ferroic circuit element that is an inductor in accordance with embodiments of the current invention may be denoted as an embedded ferroic inductor. An embedded ferroic circuit element that is a capacitor in accordance with embodiments of the current invention may be denoted as an embedded ferroic capacitor.Type: GrantFiled: May 24, 2011Date of Patent: July 14, 2015Assignee: LITTELFUSE, INC.Inventors: Robert Fleming, Bhret Graydon, Daniel Vasquez, Junjun Wu, Farhad Razavi
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Patent number: 9007165Abstract: A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.Type: GrantFiled: June 15, 2012Date of Patent: April 14, 2015Assignee: Littelfuse, Inc.Inventors: Lex Kosowsky, Robert Fleming, Bhret Graydon
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Patent number: 8968606Abstract: Various aspects provide for structures and devices to protect against spurious electrical events (e.g., electrostatic discharge). Some embodiments incorporate a voltage switchable dielectric material (VSDM) bridging a gap between two conductive pads. Normally insulating, the VSDM may conduct current from one pad to the other during a spurious electrical event (e.g., shunting current to ground). Some aspects include gaps having a gap width that is greater than 50% of a spacing between electrical leads connected to the pads. Some devices include single layers of VSDM. Some devices include multiple layers of VSDM. Various devices may be designed to increase a ratio of active volume (of VSDM) to inactive volume.Type: GrantFiled: March 25, 2010Date of Patent: March 3, 2015Assignee: Littelfuse, Inc.Inventors: Lex Kosowsky, Bhret Graydon, Robert Fleming
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Patent number: 8399773Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.Type: GrantFiled: January 27, 2010Date of Patent: March 19, 2013Assignee: Shocking Technologies, Inc.Inventors: Lex Kosowsky, Bhret Graydon, Djabbar Moustafaev, Shurui Shang, Robert Fleming
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Publication number: 20120318569Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.Type: ApplicationFiled: August 28, 2012Publication date: December 20, 2012Inventors: Robert Fleming, Lex Kosowsky, Shurui Shang, Bhret Graydon, Xiaofeng Chen, Glen Irvin
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Publication number: 20120256721Abstract: A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.Type: ApplicationFiled: June 15, 2012Publication date: October 11, 2012Inventors: Lex Kosowsky, Robert Fleming, Bhret Graydon
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Patent number: 8272123Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.Type: GrantFiled: January 19, 2011Date of Patent: September 25, 2012Assignee: Shocking Technologies, Inc.Inventors: Robert Fleming, Lex Kosowsky, Shurui Shang, Bhret Graydon, Xiaofeng Chen, Glen Irvin
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Patent number: 8203421Abstract: A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.Type: GrantFiled: April 2, 2009Date of Patent: June 19, 2012Assignee: Shocking Technologies, Inc.Inventors: Lex Kosowsky, Robert Fleming, Bhret Graydon
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Publication number: 20110317318Abstract: Ferroic circuit elements that include a set of conductive structures that are at least partially embedded within a ferroic medium are disclosed. The ferroic medium may be a voltage switched dielectric material that includes ferroic particles in accordance with various embodiments. A ferroic circuit element may be at least partially embedded within a substrate in accordance with embodiments of the current invention as an embedded ferroic circuit element. An embedded ferroic circuit element that is an inductor in accordance with embodiments of the current invention may be denoted as an embedded ferroic inductor. An embedded ferroic circuit element that is a capacitor in accordance with embodiments of the current invention may be denoted as an embedded ferroic capacitor.Type: ApplicationFiled: May 24, 2011Publication date: December 29, 2011Inventors: Robert Fleming, Bhret Graydon, Daniel Vasquez, Junjun Wu, Farhad Razavi
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Publication number: 20110211319Abstract: Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.Type: ApplicationFiled: February 25, 2011Publication date: September 1, 2011Inventors: Lex Kosowsky, Robert Fleming, Bhret Graydon, Daniel Vasquez
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Publication number: 20110211289Abstract: Various disclosed aspects provide for protecting components (e.g., integrated circuits) from spurious electrical overvoltage events, such as electrostatic discharge. Embedded components with voltage switchable dielectric materials may protect circuits against electrostatic discharge.Type: ApplicationFiled: April 28, 2011Publication date: September 1, 2011Inventors: Lex Kosowsky, Robert Fleming, Bhret Graydon, Daniel Vasquez
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Publication number: 20110173806Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.Type: ApplicationFiled: January 19, 2011Publication date: July 21, 2011Inventors: Robert Flemming, Lex Kowsowsky, Shurui Shang, Bhret Graydon, Xiaofeng Chen, Glen Irvin
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Patent number: 7867806Abstract: An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semiconductor die using non-conductive adhesive and wire bonded to bond pads on the semiconductor die and/or to pads on a substrate to which the semiconductor die is attached.Type: GrantFiled: May 22, 2007Date of Patent: January 11, 2011Assignee: Flextronics AP, LLCInventors: Bhret Graydon, William Kuang-Hue Shu
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Publication number: 20100243302Abstract: Various aspects provide for structures and devices to protect against spurious electrical events (e.g., electrostatic discharge). Some embodiments incorporate a voltage switchable dielectric material (VSDM) bridging a gap between two conductive pads. Normally insulating, the VSDM may conduct current from one pad to the other during a spurious electrical event (e.g., shunting current to ground). Some aspects include gaps having a gap width that is greater than 50% of a spacing between electrical leads connected to the pads. Some devices include single layers of VSDM. Some devices include multiple layers of VSDM. Various devices may be designed to increase a ratio of active volume (of VSDM) to inactive volume.Type: ApplicationFiled: March 25, 2010Publication date: September 30, 2010Inventors: Lex Kosowsky, Bhret Graydon, Robert Fleming
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Patent number: 7782629Abstract: A pre-drilled hole, providing a passageway between an upper and a lower surface of a printed circuit board layer, receives a passive component, for example a resistor or a capacitor. In one embodiment the component is cylindrical, with an electrically conductive contact point at each end. The hole diameter is approximately the same as the diameter of the cylindrical component. The hole is similar to a via in a printed circuit board, except that the hole is not plated through (such would cause an electrical short). Electrically conductive lines are provided to the openings of the hole on the upper and the lower surfaces of the PCB. The area of the exposed end of the cylindrical component and the termination of the conducting line is less than the area of a surface mounted component equivalent to the cylindrical component.Type: GrantFiled: July 25, 2007Date of Patent: August 24, 2010Assignee: Flextronics AP, LLCInventors: Bhret Graydon, William Kuang-Hua Shu
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Publication number: 20100187006Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.Type: ApplicationFiled: January 27, 2010Publication date: July 29, 2010Inventors: Lex Kosowsky, Bhret Graydon, Djabbar Moustafaev, Shurui Shang, Robert Fleming
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Patent number: 7649254Abstract: A structure is disclosed for connecting an electrically-connectable metal stiffener to a ground connection within a flexible substrate, the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate by a non-conducting adhesive which includes an opening over a ground connection, the adhesive opening being filled by a conductive epoxy. A sequence for applying the disclosed materials discloses a method for attaching the stiffening structure to the flexible substrate.Type: GrantFiled: May 1, 2006Date of Patent: January 19, 2010Assignee: Flextronics AP, LLCInventors: Bhret Graydon, Steve Frandrup