Patents by Inventor Bhret Robert GRAYDON

Bhret Robert GRAYDON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD ARCHITECTURE SUPPORTING MULTIPLE COMPONENT SUPPLIERS
    Publication number: 20230345627
    Abstract: Techniques and systems for electronic circuit board design is provided herein. An example apparatus comprises an input structure that couples an input voltage node on a circuit board to input nodes of more than one voltage regulator circuit, wherein at least controller footprints differ among each of the more than one voltage regulator circuit. The apparatus further comprises a shared structure that couples switch nodes of the more than one voltage regulator circuit to a first terminal of an inductor footprint common to the more than one voltage regulator circuit, and an output structure that couples a second terminal of the inductor footprint to an output voltage node.
    Type: Application
    Filed: April 26, 2022
    Publication date: October 26, 2023
    Inventors: Fatemeh ZOLFAGHAR, Rich Tat AN, Bhret Robert GRAYDON
  • Metal layering construction in flex/rigid-flex printed circuits
    Patent number: 10420208
    Abstract: A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film having a tensile strength greater than the first and second copper layers and greater than the dielectric layer.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: September 17, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Jonathan Bernard Lester, Bhret Robert Graydon, Matthew David Mickelson, Lauren Akemi Hamamoto Donegan Ryan
  • METAL LAYERING CONSTRUCTION IN FLEX/RIGID-FLEX PRINTED CIRCUITS
    Publication number: 20190075651
    Abstract: A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film having a tensile strength greater than the first and second copper layers and greater than the dielectric layer.
    Type: Application
    Filed: September 6, 2017
    Publication date: March 7, 2019
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Jonathan Bernard LESTER, Bhret Robert GRAYDON, Matthew David MICKELSON, Lauren Akemi Hamamoto Donegan RYAN