Patents by Inventor Bhupendra Kumar

Bhupendra Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12604786
    Abstract: A microelectronic assembly and a method of forming same. The assembly includes: first and second microelectronic structures; and an interface layer between the two microelectronic structures including dielectric portions in registration with dielectric layers of each of the microelectronic structures, and electrically conductive portions in registration with electrically conductive structures of each of the microelectronic structures, wherein the dielectric portions include an oxide of a metal, and the electrically conductive portions include the metal.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: April 14, 2026
    Assignee: Intel Corporation
    Inventors: Jay Prakash Gupta, Souvik Ghosh, Kimin Jun, Bhupendra Kumar, Shashi Vyas, Anup Pancholi
  • Patent number: 12078167
    Abstract: A compressor for compressing a refrigerant is described. The compressor comprises a case having at least one curved portion and at least one opening, wherein the opening is located in the at least one curved portion, an electrical terminal arranged within the at least one opening and fixed to the case, wherein the at least one opening is an elliptical opening. Also, an electrical terminal for use with a compressor is described.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: September 3, 2024
    Assignee: Copeland Europe GmbH
    Inventors: Xiaogeng Su, Linus Dellweg, Bhupendra Kumar, Francis Leon Simon Beckers, Colin Edward Bates, Mark William Lyttle
  • Publication number: 20240060419
    Abstract: Methods and systems for rock recognition are provided.
    Type: Application
    Filed: December 17, 2021
    Publication date: February 22, 2024
    Inventors: Francisco RODRIGUEZ, Bhupendra KUMAR, Saskia DUYVESTEYN
  • Publication number: 20230317687
    Abstract: Embodiments disclosed herein include a display. In an embodiment, the display comprises a backplane, and circuitry on the backplane. In an embodiment, a pad with a first width is over the backplane and electrically coupled to the circuitry. In an embodiment, the pad comprises a conductive material. In an embodiment, the display further comprises a light emitting diode (LED) coupled to the pad, where the LED has a second width that is smaller than the first width.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Inventors: Bhupendra KUMAR, Khaled AHMED, Andrew William KEATES, Jay GUPTA
  • Publication number: 20230299040
    Abstract: A microelectronic assembly and a method of forming same. The assembly includes: first and second microelectronic structures; and an interface layer between the two microelectronic structures including dielectric portions in registration with dielectric layers of each of the microelectronic structures, and electrically conductive portions in registration with electrically conductive structures of each of the microelectronic structures, wherein the dielectric portions include an oxide of a metal, and the electrically conductive portions include the metal.
    Type: Application
    Filed: March 18, 2022
    Publication date: September 21, 2023
    Applicant: Intel Corporation
    Inventors: Jay Prakash Gupta, Souvik Ghosh, Kimin Jun, Bhupendra Kumar, Shashi Vyas, Anup Pancholi