Patents by Inventor Bhupindra Singh

Bhupindra Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for evaluating decoupling capacitor placement for VLSI chips
    Patent number: 6618844
    Abstract: A method of evaluating decoupling capacitor placement for Very Large Scale Integrated Chips (VLSI) is disclosed. Included in the method is an analysis of the usage for each decoupling capacitor, the distance from the devices, and the locations of the devices and decoupling capacitors. Also addressed are the orientations and size of the components.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: September 9, 2003
    Assignee: International Business Machines Corporation
    Inventors: Allan H. Dansky, Wiren D. Becker, Howard H. Smith, Peter J. Camporese, Kwok Fai Eng, Dale E. Hoffman, Bhupindra Singh
  • Method for evaluating decoupling capacitor placement for VLSI chips
    Patent number: 6618843
    Abstract: A method of evaluating decoupling capacitor placement for Very Large Scale Integrated Chips (VLSI) is disclosed. Included in the method is an analysis of the usage for each decoupling capacitor, the distance from the devices, and the locations of the devices and decoupling capacitors. Also addressed are the orientations and size of the components.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: September 9, 2003
    Assignee: International Business Machines Corporation
    Inventors: Allan H. Dansky, Wiren D. Becker, Howard H. Smith, Peter J. Camporese, Kwok Fai Eng, Dale E. Hoffman, Bhupindra Singh
  • Method for evaluating decoupling capacitor placement for VLSI chips
    Publication number: 20020040463
    Abstract: A method of evaluating decoupling capacitor placement for Very Large Scale Integrated Chips (VLSI) is disclosed. Included in the method is an analysis of the usage for each decoupling capacitor, the distance from the devices, and the locations of the devices and decoupling capacitors. Also addressed are the orientations and size of the components.
    Type: Application
    Filed: June 29, 2001
    Publication date: April 4, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Allan H. Dansky, Wiren D. Becker, Howard H. Smith, Peter J. Camporese, Kwok Fai Eng, Dale E. Hoffman, Bhupindra Singh
  • Method for evaluating decoupling capacitor placement for VLSI chips
    Publication number: 20020040467
    Abstract: A method of evaluating decoupling capacitor placement for Very Large Scale Integrated Chips (VLSI) is disclosed. Included in the method is an analysis of the usage for each decoupling capacitor, the distance from the devices, and the locations of the devices and decoupling capacitors. Also addressed are the orientations and size of the components.
    Type: Application
    Filed: June 29, 2001
    Publication date: April 4, 2002
    Applicant: INTERNATION BUSINESS MACHINES CORPORATION
    Inventors: Allan H. Dansky, Wiren D. Becker, Howard H. Smith, Peter J. Camporese, Kwok Fai Eng, Dale E. Hoffman, Bhupindra Singh
  • Method for evaluating decoupling capacitor placement for VLSI chips
    Patent number: 6323050
    Abstract: A method of evaluating decoupling capacitor placement for Very Large Scale Integrated Chips (VLSI) is disclosed. Included in the method is an analysis of the usage for each decoupling capacitor, the distance from the devices, and the locations of the devices and decoupling capacitors. Also addressed are the orientations and size of the components.
    Type: Grant
    Filed: October 2, 2000
    Date of Patent: November 27, 2001
    Assignee: International Business Machines Corporation
    Inventors: Allan H. Dansky, Wiren D. Becker, Howard H. Smith, Peter J. Camporese, Kwok Fai Eng, Dale E. Hoffman, Bhupindra Singh