Abstract: Adhesive hot-melt formulations with a main polymeric component, of at least one isotactic metallocene butene-1 polymer composition, that has a low viscosity, and that has a bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps. Moreover, said hot-melts include less than 5% by weight of at least one viscosity modifier that is not solid at room temperature. Such unusually low level of said additives, surprisingly allows to attain substantially improved levels both of high adhesiveness and cohesion. The adhesive hot-melt formulations include less than 5% by weight of a polyethylene wax or of a blend of polyethylene waxes, that characterized by a highly linear/non-branched structure and by an exceptionally low Polydispersity Index. The presence of such peculiar polyethylene waxes, that are partially incompatible with the butene-1 polymer composition, allows to use the disclosed hot-melt formulations even in the presence of fibrous or perforated substrates.

Abstract: A new hot-melt adhesive formulations having improved processability and that are easily processable even with processes at high speed and in particular with Spraying or Fiberization processes. Said hot-melt adhesive formulations comprise, as their main polymer component, at least one isotactic metallocene butene-1 polymer composition, that has a low viscosity, and that has a substantially bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps, where the first polymer (polymer A) of said compositionally bimodal polymer composition is an isotactic butene-1 homopolymer or an isotactic butene-1 copolymer with another olefin, while the second polymer (polymer B) is an isotactic copolymer of butene-1, with another olefin, with a chemical composition obviously different from A, qualitatively and/or quantitatively; said hot-melts further comprising a viscosity modifier that is not solid at room temperature.

Abstract: Adhesive hot-melt formulations with a main polymeric component, of at least one isotactic metallocene butene-1 polymer composition, that has a low viscosity, and that has a bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps. Moreover, said hot-melts include less than 5% by weight of at least one viscosity modifier that is not solid at room temperature. Such unusually low level of said additives, surprisingly allows to attain substantially improved levels both of high adhesiveness and cohesion. The adhesive hot-melt formulations include less than 5% by weight of a polyethylene wax or of a blend of polyethylene waxes, that characterized by a highly linear/non-branched structure and by an exceptionally low Polydispersity Index. The presence of such peculiar polyethylene waxes, that are partially incompatible with the butene-1 polymer composition, allows to use the disclosed hot-melt formulations even in the presence of fibrous or perforated substrates.

Abstract: A new hot-melt adhesive formulations having improved processability and that are easily processable even with processes at high speed and in particular with Spraying or Fiberization processes. Said hot-melt adhesive formulations comprise, as their main polymer component, at least one isotactic metallocene butene-1 polymer composition, that has a low viscosity, and that has a substantially bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps, where the first polymer (polymer A) of said compositionally bimodal polymer composition is an isotactic butene-1 homopolymer or an isotactic butene-1 copolymer with another olefin, while the second polymer (polymer B) is an isotactic copolymer of butene-1, with another olefin, with a chemical composition obviously different from A, qualitatively and/or quantitatively; said hot-melts further comprising a viscosity modifier that is not solid at room temperature.