Patents by Inventor Bianca Linay

Bianca Linay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS FOR LOCATING A METAL OBJECT
    Publication number: 20230358913
    Abstract: A device for locating an object. The device includes a housing including a first hole. The device also includes a sensor carried by the housing and comprising two or more electrodes that are positioned next to each other to form a substantially circular configuration. The sensor includes a second hole formed in the center of the circular configuration, and the second hole is axially aligned with the first hole.
    Type: Application
    Filed: July 13, 2023
    Publication date: November 9, 2023
    Applicant: Stanley Black & Decker Inc.
    Inventors: Bruce EIDINGER, Yong Cushing, Michael Murray, Bianca Linay
  • Systems and methods for locating a metal object
    Patent number: 11740379
    Abstract: A device for locating an object. The device includes a housing including a first hole. The device also includes a sensor carried by the housing and comprising two or more electrodes that are positioned next to each other to form a substantially circular configuration. The sensor includes a second hole formed in the center of the circular configuration, and the second hole is axially aligned with the first hole.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: August 29, 2023
    Assignee: Stanley Black & Decker Inc.
    Inventors: Bruce Eidinger, Yong Cushing, Michael Murray, Bianca Linay
  • Systems and methods for locating a stud
    Patent number: 10571423
    Abstract: This disclosure describes a stud sensor configured to locate a stud. The stud sensor includes a housing and a sensor carried by the housing. The sensor includes two or more electrodes. The two or more electrodes are configured to form a substantially circular configuration. The stud sensor further comprises one or more processors carried by the housing. The one or more processors are communicatively coupled with the sensor. The one or more processors are configured by machine-readable instructions to calculate a stud location by measuring a change in capacitance from a fixed capacitance of a wall structure as the stud sensor is moved along a surface of the wall structure; and generate one or more signals to report a result relating to a location of a stud.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: February 25, 2020
    Assignee: STANLEY BLACK & DECKER INC.
    Inventors: Bruce Eidinger, Yong Cushing, Michael Murray, Bianca Linay
  • SYSTEMS AND METHODS FOR LOCATING A STUD
    Publication number: 20170370868
    Abstract: This disclosure describes a stud sensor configured to locate a stud. The stud sensor includes a housing and a sensor carried by the housing. The sensor includes two or more electrodes. The two or more electrodes are configured to form a substantially circular configuration. The stud sensor further comprises one or more processors carried by the housing. The one or more processors are communicatively coupled with the sensor. The one or more processors are configured by machine-readable instructions to calculate a stud location by measuring a change in capacitance from a fixed capacitance of a wall structure as the stud sensor is moved along a surface of the wall structure; and generate one or more signals to report a result relating to a location of a stud.
    Type: Application
    Filed: June 23, 2017
    Publication date: December 28, 2017
    Inventors: Bruce EIDINGER, Yong Cushing, Michael Murray, Bianca Linay