Patents by Inventor Biancun Xie

Biancun Xie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200395300
    Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly including a substrate having a conductive plane; and a bridge having first contacts at a first surface and second contacts at an opposing second surface, wherein the bridge is embedded in the substrate and coupled to the conductive plane in the substrate via the first contacts, wherein the bridge is coupled to a first die and a second die via the second contacts, and wherein the bridge does not include a silicon substrate.
    Type: Application
    Filed: June 13, 2019
    Publication date: December 17, 2020
    Applicant: Intel Corporation
    Inventors: Biancun Xie, Jianyong Xie, Sujit Sharan, Debendra Mallik, Robert L. Sankman