Abstract: An alkoxyhydridosiloxane resin composition comprising ROSiO3/2 siloxane units and HSiO3/2 siloxane units wherein R is an alkyl group having 10 to 28 carbon atoms, wherein the alkoxyhydridosiloxane resin contains an average from 5 to 40 mole percent silicon bonded alkoxy groups, and wherein the alkoxyhydridosiloxane resin contains an average of at least 45 mole percent silicon bonded hydrogen atoms. While not represented by the structure, the resins may also contain a small number of atoms which have either 0 or 2 hydrogen atoms attached thereto and/or a small number of SiC groups such as CH3SiO3/2 or HCH3SiO2/2 groups. These resins are useful for forming nanoporous silicone resin coatings having low dielectric constant coatings useful for electrical insulating coatings on electronic devices.

Abstract: Soluble silicone resin compositions having good solution stability and a method for their preparation. The silicone resin comprises the reaction product of a mixture comprising (A) 15-70 mol % of a tetraalkoxysilane described by formula Si(OR1)4, where each R1 is an independently selected alkyl group comprising 1 to about 6 carbon atoms, (B) 12 to 60 mol % of a hydrosilane described by formula HSiX3, where each X is an independently selected hydrolyzable substituent, (C) 15 to 70 mole percent of an organotrialkoxysilane described by formula R2Si(OR3)3, where R2 is a hydrocarbon group comprising about 8 to 24 carbon atoms or a substituted hydrocarbon group comprising a hydrocarbon chain having about 8 to 24 carbon atoms and each R3 is an independently selected alkyl group comprising 1 to about 6 carbon atoms; in the presence of (D) water, (E) hydrolysis catalyst, and (F) organic solvent for the reaction product.

Abstract: Nanoporous silicone resins and silicone resin films having low dielectric constants and a method for preparing such nanoporous silicone resins.

Abstract: Soluble silicone resin compositions having good solution stability and a method for their preparation.

Abstract: The present invention relates to a foam control composition and to its use in foaming systems. More particularly, this invention relates to a foam control composition comprising a polysiloxane and a resin-filler made from MQ resins having at least one polyoxyalkylene group. The compositions of this invention exhibit excellent defoam effects and antifoam persistency.

Abstract: A method for preparing a microporous silicone resin which can be used to form low dielectric constant films useful for electrical insulating coatings on electronic devices comprising (A) contacting a hydridosilicon containing resin with an alkenyltriarylsilane in the presence of a platinum group metal-containing hydrosilation catalyst effecting formation of a silicon resin where at least 5 percent of silicon atoms are substituted with at least one triarylsilylalkylene group and at least 45 percent of silicon atoms are substituted with at least one hydrogen atom and (B) heating the silicon resin of step (A) in an inert atmosphere at a temperature sufficient to effect thermolysis of the triarylsilylalkylene groups from the silicon atoms.

Abstract: A method for preparing a nanoporous silicone resin which can be used to form low dielectric constant films useful for electrical insulating coatings on electronic devices comprising (A) contacting a hydridosilicon containing resin with a 1-alkene comprising about 8 to 28 carbon atoms in the presence of a platinum group metal-containing hydrosilation catalyst effecting formation of an alkylhydridosiloxane resin where at least 5 percent of silicon atoms are substituted with at least one group comprising about 8 to 28 carbon atoms and at least 45 percent of silicon atoms are substituted with at least one hydrogen atom and (B) heating the alkylhydridosiloxane resin of step (A) at a temperature sufficient to effect curing and thermolysis of alkyl groups comprising about 8 to 28 carbon atoms from the silicon atoms thereby forming a nanoporous silicone resin.

Abstract: A method for preparing a nanoporous silicone resin which can be used to form low dielectric constant films useful for electrical insulating coatings on electronic devices comprising (A) contacting a hydridosilicon containing resin with a 1-alkene comprising about 8 to 28 carbon atoms in the presence of a platinum group metal-containing hydrosilation catalyst effecting formation of an alkylhydridosiloxane resin where at least 5 percent of silicon atoms are substituted with at least one group comprising about 8 to 28 carbon atoms and at least 45 percent of silicon atoms are substituted with at least one hydrogen atom and (B) heating the alkylhydridosiloxane resin of step (A) at a temperature sufficient to effect curing and thermolysis of alkyl groups comprising about 8 to 28 carbon atoms from the silicon atoms thereby forming a nanoporous silicone resin.

Abstract: This invention relates to resin-fillers and compositions containing the resin-fillers. Resin-fillers are the reaction product of a resin having monofunctional siloxane (M) units and tetrafunctional siloxane (Q) units, chemically linked to a crosslinker by addition reaction. The resin-fillers have properties more similar to those of silica fillers and less like those of conventional MQ resins. The resin-fillers are insoluble in solvents, form homogeneous blends with silicone polymers, and dramatically impact modulus and viscosity of a polymer even at low (e.g. 5 to 10 wt %) loading.

Abstract: An ultra-high molecular weight MQ resin and a method for its preparation are disclosed. The ultra-high molecular weight MQ resin has weight average molecular weight of at least 100,000, and the ultra-high molecular weight MQ resin is soluble in organic solvents.

Abstract: The present invention relates to a method of making silicone pressure sensitive adhesive compositions comprising the steps of heating a mixture of a polydiorganosiloxane, a silicone resin copolymer, and an equilibration catalyst, and then adding an organic peroxide or azo compound to the resultant reaction product. The silicone pressure sensitive adhesives prepared by the method of this invention are useful in preparing articles such as pressure sensitive tapes, labels, emblems and other decorative or informational signs.