Patents by Inventor Biao Peng

Biao Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250029905
    Abstract: A structure of a chip package integrated antenna and a manufacturing method thereof are proposed, and the structure includes a substrate, at least one chip unit, at least two conductive units, an encapsulation, at least two conductive structures and an antenna. The chip unit and the two conductive units are disposed on the substrate. The encapsulation covers the chip unit and the two conductive units, and has a top surface and at least two through holes. The two through holes are respectively formed between the top surface and the two conductive units. The two conductive structures are respectively disposed on the two conductive units and located in the two through holes. The antenna is disposed on the top surface and connected to the two conductive structures, and is electrically connected to the chip unit through the two conductive structures, the two conductive units and the substrate in sequence.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 23, 2025
    Inventors: HONGSONG YU, BIAO HU, YANBIN PENG
  • Publication number: 20240230788
    Abstract: A computerized simulation validating method for a full-scale distribution network single phase-to-ground fault test is implemented by simulating a full-scale test system with external quantities being controlled to be conformant and validating the full-scale distribution network single phase-to-ground fault test based on a conformance check result between the internal quantities of the field testing and the internal quantities of the simulation testing. The simulation validating method for a full-scale distribution network single phase-to-ground fault test improves normalization and conformance of the full-scale distribution network ground fault test. The computerized simulation validating system, apparatus, and medium for a full-scale distribution network single phase-to-ground fault test also achieve the benefits noted above.
    Type: Application
    Filed: August 11, 2023
    Publication date: July 11, 2024
    Inventors: Zhi LI, Shaofeng YU, Dingfang KE, Peibo WANG, Kan SUN, Weiqiang LANG, Haijiang XU, Kelong WANG, Zhiyong LI, Kun YU, Guangyao YING, Xuqiang HE, Yezhao CHEN, Xiang ZHANG, Mingxiao DU, Huijuan GUI, Hongling HU, Biao PENG, Xubin XIAO
  • Publication number: 20240133975
    Abstract: A computerized simulation validating method for a full-scale distribution network single phase-to-ground fault test is implemented by simulating a full-scale test system with external quantities being controlled to be conformant and validating the full-scale distribution network single phase-to-ground fault test based on a conformance check result between the internal quantities of the field testing and the internal quantities of the simulation testing. The simulation validating method for a full-scale distribution network single phase-to-ground fault test improves normalization and conformance of the full-scale distribution network ground fault test. The computerized simulation validating system, apparatus, and medium for a full-scale distribution network single phase-to-ground fault test also achieve the benefits noted above.
    Type: Application
    Filed: August 10, 2023
    Publication date: April 25, 2024
    Inventors: Zhi LI, Shaofeng YU, Dingfang KE, Peibo WANG, Kan SUN, Weiqiang LANG, Haijiang XU, Kelong WANG, Zhiyong LI, Kun YU, Guangyao YING, Xuqiang HE, Yezhao CHEN, Xiang ZHANG, Mingxiao DU, Huijuan GUI, Hongling HU, Biao PENG, Xubin XIAO
  • Publication number: 20230343878
    Abstract: Disclosed are a high-efficiency and high-reliability PERC solar cell and a front electrode thereof, and a manufacturing method, which belong to the solar cell technology. Busbars of the front electrode of solar cell of the present disclosure includes fine busbars and solder joints distributed on the fine busbars at intervals. Each fine busbar between adjacent solder joints includes a straight fine busbar connecting the two solder joints, and side fine busbars located on both sides of the straight fine busbar respectively. In the method for manufacturing the front electrode, the busbars and the fingers are printed by a step-by-step printing process.
    Type: Application
    Filed: December 22, 2021
    Publication date: October 26, 2023
    Inventors: Zhi HUANG, Lin ZHANG, Wei XIA, Guanqun XU, Tao XU, Liubin WAN, Biao PENG, Feng GU, Xujin ZHAI, Taihong XIE
  • Patent number: 10211499
    Abstract: The present invention discloses a four-mode defected ground structure resonator, comprising a metal dielectric substrate and a defected ground unit which is etched in one surface of the metal dielectric substrate; the shape of the defected ground unit is axially symmetric about a first central axis of the defected ground unit, and also the shape of the defected ground unit is axially symmetric about a second central axis of the defected ground unit; the first defected ground unit is provided with H-shape or quasi H-shape, the second defected ground unit is provided with L-shape, quasi L-shape, U-shape or quasi U-shape. The four-mode defected ground structure resonator of the present invention is provided with four types of resonant modes, and the four types of resonant modes are provided with good tunability.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: February 19, 2019
    Assignee: QINDAO HAIER ELECTRONICS CO., LTD.
    Inventors: Biao Peng, Shufang Li, Shuai Wang, Ling Wang, Yili Zhai, Xijia Hu
  • Patent number: 10170814
    Abstract: Disclosed is a four-mode defected ground structure filter, including a four-mode defected ground structure resonator and two microstrip feed lines. The four-mode defected ground structure resonator comprises a metal dielectric substrate and a defected ground unit which is etched in one surface of the metal dielectric substrate; the microstrip feed lines are arranged at another surface of the metal dielectric substrate; shape of the defected ground unit is axially symmetric about a first central axis of the defected ground unit, and is axially symmetric about a second central axis of the defected ground unit; the first defected ground unit is provided with H-shape or quasi H-shape, the second defected ground unit is provided with L-shape, quasi L-shape, U-shape or quasi U-shape.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: January 1, 2019
    Assignee: QINGDAO HAIER ELECTRONICS CO., LTD.
    Inventors: Biao Peng, Shufang Li, Shuai Wang, Ling Wang, Yili Zhai, Xijia Hu
  • Publication number: 20170237136
    Abstract: Disclosed is a four-mode defected ground structure filter, including a four-mode defected ground structure resonator and two microstrip feed lines. The four-mode defected ground structure resonator comprises a metal dielectric substrate and a defected ground unit which is etched in one surface of the metal dielectric substrate; the microstrip feed lines are arranged at another surface of the metal dielectric substrate; shape of the defected ground unit is axially symmetric about a first central axis of the defected ground unit, and is axially symmetric about a second central axis of the defected ground unit; the first defected ground unit is provided with H-shape or quasi H-shape, the second defected ground unit is provided with L-shape, quasi L-shape, U-shape or quasi U-shape.
    Type: Application
    Filed: December 21, 2016
    Publication date: August 17, 2017
    Inventors: Biao Peng, Shufang Li, Shuai Wang, Ling Wang, Yili Zhai, Xijia Hu
  • Publication number: 20170237138
    Abstract: The present invention discloses a four-mode defected ground structure resonator, comprising a metal dielectric substrate and a defected ground unit which is etched in one surface of the metal dielectric substrate; the shape of the defected ground unit is axially symmetric about a first central axis of the defected ground unit, and also the shape of the defected ground unit is axially symmetric about a second central axis of the defected ground unit; the first defected ground unit is provided with H-shape or quasi H-shape, the second defected ground unit is provided with L-shape, quasi L-shape, U-shape or quasi U-shape. The four-mode defected ground structure resonator of the present invention is provided with four types of resonant modes, and the four types of resonant modes are provided with good tunability.
    Type: Application
    Filed: December 21, 2016
    Publication date: August 17, 2017
    Inventors: Biao Peng, Shufang Li, Shuai Wang, Ling Wang, Yili Zhai, Xijia Hu
  • Publication number: 20130048205
    Abstract: A method for forming a frame includes: (1) providing a thermosetting strip-shaped matrix material and a mandrel, and rolling the strip-shaped matrix material onto the mandrel to form a matrix body; (2) cutting the matrix body to form a plurality of preformed bodies, each having a predetermined height H; (3) providing a mold having a core, the shape of the core corresponding to the shape of the frame, and sleeving the preformed body on the core; (4) putting the mold to a hot press device, and hot pressing the preformed body to form the frame; (5) taking out the frame from the mold.
    Type: Application
    Filed: November 23, 2011
    Publication date: February 28, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: YI XIONG, ZHI-HUA LIN, JIN-BIAO PENG