Abstract: A display module includes a substrate, a plurality of pixel units are arrayed on the substrate, and each of the pixel units is provided with at least three light-emitting chips, and the centers of at least three light-emitting chips are not collinear; and the projections of at least three light-emitting chips along a first direction at least partially overlap, and the projections of at least three light-emitting chips along a second direction at least partially overlap where the first direction is perpendicular to the second direction.

Abstract: An apparatus includes a functional circuit, including a power supply node, and a test circuit. The functional circuit is configured to operate in a test mode that includes generating respective test output patterns in response to application of a plurality of test stimulus patterns. The test circuit is configured to identify a particular test stimulus pattern of the plurality of test stimulus patterns, and to reapply the particular test stimulus pattern to the functional circuit multiple times. The test circuit is further configured to vary, for each reapplication, a start time of the particular test stimulus pattern in relation to when a voltage level of the power supply node is sampled for that reapplication.

Abstract: An apparatus includes a functional circuit, including a power supply node, and a test circuit. The functional circuit is configured to operate in a test mode that includes generating respective test output patterns in response to application of a plurality of test stimulus patterns. The test circuit is configured to identify a particular test stimulus pattern of the plurality of test stimulus patterns, and to reapply the particular test stimulus pattern to the functional circuit multiple times. The test circuit is further configured to vary, for each reapplication, a start time of the particular test stimulus pattern in relation to when a voltage level of the power supply node is sampled for that reapplication.

Abstract: Techniques are disclosed relating to memory testing. In one embodiment, an integrated circuit is disclosed that includes a memory and an interface circuit. The interface circuit is configured to receive one or more testing signals from a built in self-test (BIST) unit. The interface circuit is further configured to receive, independently from the one or more testing signals, one or more configuration signals from automated test equipment (ATE). The interface circuit is further configured to issue one or more instruction signals to the memory based on the one or more testing signals and based on the one or more configuration signals. In some embodiments, the interface circuit is configured to enable the BIST unit to detect errors in functions the BIST unit is not designed to test.

Abstract: A hardware assisted scheme for testing IC memories using scan circuitry is disclosed. An IC includes a memory implemented thereon and a chain of serially-coupled scan elements to enable the inputting of test vectors. The scan elements include first and second subsets forming write and read address registers, respectively, a first control flop, and a second control flop. During a launch cycle of a test operation, a first address loaded into the write address register is provided to a write address decoder to effect a write operation. Also responsive to the launch cycle, the first control flop is configured to cause the first address to be provided to the read address register, while the second control flop causes data to be written into the memory. During a capture cycle, the first address is provided to a read address decoder and the second control flop causes a read of data therefrom.

Abstract: Techniques are disclosed relating to memory testing. In one embodiment, an integrated circuit is disclosed that includes a memory and an interface circuit. The interface circuit is configured to receive one or more testing signals from a built in self-test (BIST) unit. The interface circuit is further configured to receive, independently from the one or more testing signals, one or more configuration signals from automated test equipment (ATE). The interface circuit is further configured to issue one or more instruction signals to the memory based on the one or more testing signals and based on the one or more configuration signals. In some embodiments, the interface circuit is configured to enable the BIST unit to detect errors in functions the BIST unit is not designed to test.

Abstract: Techniques are disclosed relating to test equipment. In one embodiment, a method includes receiving failure information from a first test of a device under test (DUT). In this embodiment, the DUT includes a plurality of scan chains that each include a plurality of scan cells. In this embodiment, the first test is based on a first compressed test pattern. In this embodiment, the failure information does not permit a definitive determination as to which scan cell is a failing scan cell. In this embodiment, the method includes generating a plurality of compressed test patterns based on the first compressed test pattern. In this embodiment, the plurality of compressed test patterns specify one-to-one-modes. In this embodiment, the method includes performing one or more second tests of the DUT using the plurality of compressed test patterns to definitively determine one or more failing scan cells.

Abstract: Techniques are disclosed relating to memory testing. In one embodiment, an integrated circuit is disclosed that includes a memory and an interface circuit. The interface circuit is configured to receive one or more testing signals from a built in self-test (BIST) unit. The interface circuit is further configured to receive, independently from the one or more testing signals, one or more configuration signals from automated test equipment (ATE). The interface circuit is further configured to issue one or more instruction signals to the memory based on the one or more testing signals and based on the one or more configuration signals. In some embodiments, the interface circuit is configured to enable the BIST unit to detect errors in functions the BIST unit is not designed to test.

Abstract: Techniques are disclosed relating to test equipment. In one embodiment, a method includes receiving failure information from a first test of a device under test (DUT). In this embodiment, the DUT includes a plurality of scan chains that each include a plurality of scan cells. In this embodiment, the first test is based on a first compressed test pattern. In this embodiment, the failure information does not permit a definitive determination as to which scan cell is a failing scan cell. In this embodiment, the method includes generating a plurality of compressed test patterns based on the first compressed test pattern. In this embodiment, the plurality of compressed test patterns specify one-to-one-modes. In this embodiment, the method includes performing one or more second tests of the DUT using the plurality of compressed test patterns to definitively determine one or more failing scan cells.

Abstract: Techniques are disclosed relating to memory testing. In one embodiment, an integrated circuit is disclosed that includes a memory and an interface circuit. The interface circuit is configured to receive one or more testing signals from a built in self-test (BIST) unit. The interface circuit is further configured to receive, independently from the one or more testing signals, one or more configuration signals from automated test equipment (ATE). The interface circuit is further configured to issue one or more instruction signals to the memory based on the one or more testing signals and based on the one or more configuration signals. In some embodiments, the interface circuit is configured to enable the BIST unit to detect errors in functions the BIST unit is not designed to test.