Patents by Inventor Biff Roberson

Biff Roberson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110274915
    Abstract: A recycled plastic chip construction panel includes a thermoplastic sheet base layer, a thermoplastic chip core layer bonded to a first thermoplastic base layer, and a thermoplastic finish layer bonded, on top of the thermoplastic chip core layer, to the thermoplastic sheet base layer and the thermoplastic chip core layer.
    Type: Application
    Filed: May 10, 2010
    Publication date: November 10, 2011
    Inventor: Biff Roberson