Patents by Inventor Bigal Leung

Bigal Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Direct cooling pallet assembly for temperature stability for deep ion mill etch process
    Patent number: 7481312
    Abstract: Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: January 27, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Pei Chen, Jorge Goitia, Cherngye Hwang, Bigal Leung, Diana Perez, Yongjian Sun
  • Direct cooling pallet tray for temperature stability for deep ion mill etch process
    Patent number: 7296420
    Abstract: Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: November 20, 2007
    Assignee: Hitachi Global Storage Technologies Amsterdam, B.V.
    Inventors: Pei Chen, Jorge Goitia, Cherngye Hwang, Bigal Leung, Diana Perez, Yongjian Sun
  • Direct cooling pallet assembly for temperature stability for deep ion mill etch process
    Publication number: 20060118447
    Abstract: Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.
    Type: Application
    Filed: December 2, 2004
    Publication date: June 8, 2006
    Inventors: Pei Chen, Jorge Goitia, Cherngye Hwang, Bigal Leung, Diana Perez, Yongjian Sun
  • Direct cooling pallet tray for temperature stability for deep ion mill etch process
    Publication number: 20060117762
    Abstract: Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.
    Type: Application
    Filed: December 2, 2004
    Publication date: June 8, 2006
    Inventors: Pei Chen, Jorge Goitia, Cherngye Hwang, Bigal Leung, Diana Perez, Yongjian Sun