Abstract: The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50K? and leakage current of below 100 ?Amp under operational voltage.

Abstract: The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50 K? and leakage current of below 100 ?Amp under operational voltage.

Abstract: The invention discloses a curable ink composition which comprises about 1-10 parts by weight of a curable epoxy resin system, about 1-30 parts by weight of ferroelectric ceramic powders, about 0.1-10 parts by weight of a polymeric dispersant, and about 50-96 parts by weight of a solvent. The ink composition is suitable for forming a high dielectric film by inkjet printing for built-in capacitors.

Abstract: The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.

Abstract: The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.